Halogen-free resin composition, highly-flame-retardant printed circuit board and display equipment
A technology of resin composition and printed circuit board, which is applied in the direction of printed circuit, circuit substrate material, printed circuit components, etc. It can solve the problems of low dielectric constant, high flame retardancy and low expansion coefficient of PCB board at the same time , to achieve low dielectric constant and dielectric loss factor, improve the dielectric constant and dielectric loss factor, low shrinkage effect
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Embodiment 1
[0056] A halogen-free resin composition, comprising the following raw material components in parts by weight:
[0057] Phosphorous epoxy resin: 70 parts by weight,
[0058] Cyanate resin: 15 parts by weight,
[0059] Benzoxazine resin: 15 parts by weight,
[0060] Silicon nitride: 40 parts by weight.
[0061] A PCB board is made of the above-mentioned halogen-free resin composition.
Embodiment 2
[0063] A halogen-free resin composition, comprising the following raw material components in parts by weight:
[0064] Phosphorous epoxy resin: 70 parts by weight,
[0065] Cyanate resin: 20 parts by weight,
[0066] Benzoxazine resin: 10 parts by weight,
[0067] Silicon nitride: 30 parts by weight.
[0068] A PCB board is made of the above-mentioned halogen-free resin composition.
Embodiment 3
[0070] A halogen-free resin composition, comprising the following raw material components in parts by weight:
[0071] Phosphorous epoxy resin: 70 parts by weight,
[0072] Cyanate resin: 10 parts by weight,
[0073] Benzoxazine resin: 20 parts by weight,
[0074] Silicon nitride: 40 parts by weight.
[0075] A PCB board is made of the above-mentioned halogen-free resin composition.
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