Halogen-free resin composition, highly-flame-retardant printed circuit board and display equipment
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A technology of resin composition and printed circuit board, which is applied in the direction of printed circuit, circuit substrate material, printed circuit components, etc. It can solve the problems of low dielectric constant, high flame retardancy and low expansion coefficient of PCB board at the same time , to achieve low dielectric constant and dielectric loss factor, improve the dielectric constant and dielectric loss factor, low shrinkage effect
Pending Publication Date: 2020-04-17
SHENZHEN ABSEN OPTOELECTRONIC CO LTD +1
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[0004] The purpose of the present invention is to provide a halogen-free resin composition, which aims to solve the technical problems that existing PCB boards cannot simultaneously have high flame retardancy, high thermal conductivity, low dielectric constant, and low expansion coefficient.
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Embodiment 1
[0056] A halogen-free resin composition, comprising the following raw material components in parts by weight:
[0057] Phosphorous epoxy resin: 70 parts by weight,
[0058] Cyanate resin: 15 parts by weight,
[0059] Benzoxazine resin: 15 parts by weight,
[0060] Silicon nitride: 40 parts by weight.
[0061] A PCB board is made of the above-mentioned halogen-free resin composition.
Embodiment 2
[0063] A halogen-free resin composition, comprising the following raw material components in parts by weight:
[0064] Phosphorous epoxy resin: 70 parts by weight,
[0065] Cyanate resin: 20 parts by weight,
[0066] Benzoxazine resin: 10 parts by weight,
[0067] Silicon nitride: 30 parts by weight.
[0068] A PCB board is made of the above-mentioned halogen-free resin composition.
Embodiment 3
[0070] A halogen-free resin composition, comprising the following raw material components in parts by weight:
[0071] Phosphorous epoxy resin: 70 parts by weight,
[0072] Cyanate resin: 10 parts by weight,
[0073] Benzoxazine resin: 20 parts by weight,
[0074] Silicon nitride: 40 parts by weight.
[0075] A PCB board is made of the above-mentioned halogen-free resin composition.
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Abstract
The invention belongs to the technical field of composite materials, and particularly relates to a halogen-free resin composition. The halogen-free resin composition comprises 20-100 parts of phosphorus-containing epoxy resin, 10-50 parts of cyanate ester resin, 10-25 parts of benzoxazine resin and 10-50 parts of an inorganic filler. The phosphorus-containing epoxy resin is used as main resin, thecyanate ester resin and benzoxazine resin are used for assistance, the glass transition temperature and viscosity of the resin composition are adjusted by adjusting the content of the cyanate ester resin and the benzoxazine resin, and the flame retardant property of the composition is further enhanced through the inorganic filler. The halogen-free resin composition provided by the invention has the advantages of high flame retardancy, low dielectric constant, high glass transition temperature and proper viscosity through the joint and interaction of the raw material components with specific proportions.
Description
technical field [0001] The invention belongs to the technical field of composite materials, and in particular relates to a halogen-free resin composition, a highly flame-resistant printed circuit board, and a display device. Background technique [0002] With the development of small spacing and Micro-LED technology, LED display equipment is more and more widely used in various places. When LED display equipment is used in harsh environments such as high temperature or rain, it will cause short circuit of electronic components, which will cause fire. Therefore, it is urgent to solve the problem of fire and flame retardancy of LED display devices. Some manufacturers have improved the structure of the LED display device, such as adding a fan inside the box; setting a flame-retardant board under the PCB board, etc., to improve the flame retardancy of the display device, but this method has a high process cost and a high resistance to heat. The burning effect is not very ideal...
Claims
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Application Information
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