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Coated PC composite board and manufacturing process thereof

A technology of composite board and first niobium oxide, which is applied in metal material coating process, sputtering plating, ion implantation plating, etc., can solve the problems of high cost, low production capacity, high requirements of coating process, etc., and achieve optimal attachment Focus on the effect

Pending Publication Date: 2020-04-17
安徽立光电子材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the application of colorful back cover of mobile phone in the consumer market is becoming more and more popular. At present, magnetron sputtering or electron gun vacuum plating is mainly used. The magnetron sputtering method has high production capacity, but has high requirements for coating technology and poor adhesion. Electron gun vacuum plating Suitable for various color products
But the speed is slow, the production capacity is low, and the cost is high

Method used

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  • Coated PC composite board and manufacturing process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A coated PC composite board comprises, from top to bottom, a first niobium oxide layer, a silicon dioxide layer, a second niobium oxide layer, an ink layer and a PC composite board.

[0020] Further, the thickness of the first niobium oxide layer is 58nm.

[0021] Further, the thickness of the silicon dioxide layer is 25nm.

[0022] Further, the thickness of the second niobium oxide layer is 38nm.

[0023] A kind of preparation technology of the PC composite board of described coating comprises the following processing steps:

[0024] Step 1: Install the niobium oxide target and silicon dioxide target in the coating box, close the box, raise the temperature to 250°C, bake the coating box for 1.5 hours, and continuously vacuumize the box to remove the Water vapor and miscellaneous gases;

[0025] Step 2, wait until the local vacuum reaches 5×10 -4 Pa, filled with argon and oxygen with a purity of 99.99%, so that the working pressure reaches 0.5Pa;

[0026] Step 3, t...

Embodiment 2

[0028] A coated PC composite board comprises, from top to bottom, a first niobium oxide layer, a silicon dioxide layer, a second niobium oxide layer, an ink layer and a PC composite board.

[0029] Further, the thickness of the first niobium oxide layer is 53nm.

[0030] Further, the thickness of the silicon dioxide layer is 23nm.

[0031] Further, the thickness of the second niobium oxide layer is 35nm.

[0032] A kind of preparation technology of the PC composite board of described coating comprises the following processing steps:

[0033] Step 1: Install the niobium oxide target and silicon dioxide target in the coating box, close the box, raise the temperature to 280°C, bake the coating box for 1 hour, and continuously vacuum to remove the water in the box steam and fumes;

[0034] Step 2, wait until the local vacuum reaches 5×10 -4 Pa, filled with argon and oxygen with a purity of 99.99%, so that the working pressure reaches 0.6Pa;

[0035] Step 3, turn on the ion so...

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Abstract

The invention relates to a coated PC composite board and a manufacturing process thereof. The PC composite board sequentially comprises a first niobium oxide layer, a silicon dioxide layer, a second niobium oxide layer, an ink layer and a PC composite board body from top to bottom. The process comprises the following steps: mounting a niobium oxide target material and a silicon dioxide target material in a coated box body, closing the box body, continuously vacuumizing to remove water vapor and miscellaneous gas in the box body, when the local vacuum degree reaches 5*10<-4> pa, feeding oxygenand argon with the purity of 99.99% to working pressure of 0.3-0.8 Pa, turning on an ion source, turning on a target material power supply, starting coating, carrying out magnetron sputtering in the vacuum box body, bombarding the surface of the target material by Ar, and sequentially plating 58+ / -8nm niobium oxide, 25+ / -5nm silicon dioxide and 38+ / -8nm niobium oxide on the PC composite board which is treated by the ion source and is printed with the ink. According to the invention, the composite film layer is plated on the PC composite board coated with the ink, so that the adhesive force ofthe film layer is optimized.

Description

technical field [0001] The invention relates to the technical field of PC composite board coating, in particular to a coated PC composite board and a manufacturing process thereof. Background technique [0002] At present, the application of colorful back cover of mobile phone in the consumer market is becoming more and more popular. At present, magnetron sputtering or electron gun vacuum plating is mainly used. The magnetron sputtering method has high production capacity, but has high requirements for coating technology and poor adhesion. Electron gun vacuum plating Suitable for various color products. But the speed is slow, the production capacity is low, and the cost is high. Contents of the invention [0003] In order to solve this problem, considering the advantages of cost and performance, the magnetron sputtering method is used for large-area coating, and niobium oxide and silicon dioxide are plated on the PC composite board. The invention provides a coated PC comp...

Claims

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Application Information

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IPC IPC(8): C23C14/02C23C14/34C23C14/08C23C14/10
CPCC23C14/022C23C14/024C23C14/083C23C14/10C23C14/3407
Inventor 张石亮张继凡杨凯
Owner 安徽立光电子材料股份有限公司
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