The invention relates to a coated PC composite board and a manufacturing process thereof. The PC composite board sequentially comprises a first
niobium oxide layer, a
silicon dioxide layer, a second
niobium oxide layer, an ink layer and a PC composite board body from top to bottom. The process comprises the following steps: mounting a
niobium oxide target material and a
silicon dioxide target material in a coated box body, closing the box body, continuously vacuumizing to remove
water vapor and miscellaneous gas in the box body, when the local vacuum degree reaches 5*10<-4> pa, feeding oxygenand
argon with the purity of 99.99% to
working pressure of 0.3-0.8 Pa, turning on an
ion source, turning on a target material power supply, starting
coating, carrying out magnetron
sputtering in the vacuum box body, bombarding the surface of the target material by Ar, and sequentially plating 58+ / -8nm
niobium oxide, 25+ / -5nm
silicon dioxide and 38+ / -8nm
niobium oxide on the PC composite board which is treated by the
ion source and is printed with the ink. According to the invention, the
composite film layer is plated on the PC composite board coated with the ink, so that the
adhesive force ofthe film layer is optimized.