Biological recognition module and preparation method thereof

Abstract

The invention relates to a biological recognition module and a preparation method thereof. The method comprises the steps of: providing a substrate with a first surface and a second surface which areopposite to each other, and forming a first dielectric layer and a conductive wiring layer on the first surface of the substrate, forming a slotted region in the first dielectric layer, and then embedding an elastic buffer layer in the slotted region, providing a carrier plate, setting a release film and a biological recognition chip on the carrier plate, forming a metal retaining wall structure at the periphery of a bonding pad of the biological recognition chip through a photoetching process, arranging solder balls in an area, corresponding to the bonding pads, in the conductive wiring layer, then setting the biological recognition chip on the conductive wiring layer, enabling the elastic buffer layer to be in contact with the biological recognition chip, and melting the solder balls through a reflow soldering process to be embedded into the corresponding metal retaining wall structures, forming a plastic package layer on the substrate and forming a conductive column in the plastic package layer, and finally, thinning the substrate.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a biometric identification module and a preparation method thereof. Background technique [0002] In the existing biometric identification module, usually a hard encapsulation material layer is formed on the biometric identification chip, then the encapsulation material layer is thinned, and then a protective cover is provided on the thinned encapsulation material layer. During the use of the existing biometric identification module, since the biometric identification module is pressed many times for a long time, the functional area of ​​the biometric identification chip is easily damaged under the action of the pressing force. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art, and provide a biometric identification module and a preparation method thereof. [0004] In order to achieve ...

AI Technical Summary

Problems solved by technology

During the use of the existing biometric identification module, the functional area of ​​the biometric identification chip is easily damaged under the action of pressing force due to the long-term pressing of the biometric identification module

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