Semiconductor production and processing equipment capable of preventing deformation and using method thereof
A semiconductor and equipment technology, applied in the field of semiconductor production and processing equipment that prevents deformation, can solve problems such as pin or main body deformation, affecting product quality, etc., and achieve the effect of wide applicability
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Embodiment 1
[0035] Embodiment 1: see Figure 1-5 , a semiconductor production and processing equipment for preventing deformation, comprising a bottom plate 2, a top plate 3, a pole 4 and two sets of clamping assemblies, the bottom plate 2 and the top plate 3 are rectangular plates and arranged parallel to each other, the bottom plate 2 and The top boards 3 are fixed by poles 4, and the middle part of the bottom surface of the bottom board 2 and the middle part of the top surface of the top board 3 are equipped with rotating motors 6. Two groups of clamping assemblies are arranged symmetrically between the bottom board 2 and the top board 3, and the two clamps Tight assembly is all connected with the output shaft driving of rotating motor 6.
[0036] The clamping assembly includes a turntable 10, a first push rod 12, a mounting frame 15 and an adjustment mechanism. The middle part of the turntable 10 is drivingly coupled with the output shaft of the motor 6, and the side of the turntable ...
Embodiment 2
[0046] Example 2: see Image 6 , in this embodiment, a method of using equipment for semiconductor production and processing to prevent deformation, specifically includes the following steps:
[0047] Step 1: Normal power-on work, the motor 24 in the clamping assembly works, the driving gear 23 rotates, thereby driving the corresponding tooth plate 16 to slide along the extension direction of each end rod of the mounting bracket 15, and adjusting the position of each movable block 17, which is convenient Clamping semiconductor packages;
[0048] Step 2: basically place the semiconductor to be processed on each clamping rod 14 in the lower clamping assembly
[0049] The top surface of the first push rod 12 in the two clamping assemblies is pushed out, driving the two clamping assemblies closer together, when the end faces of the clamping rods 14 in the upper clamping assembly are pressed against the semiconductor package Just above.
[0050] Step 3: make the rotating motor 6...
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