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Semiconductor production and processing equipment capable of preventing deformation and using method thereof

A semiconductor and equipment technology, applied in the field of semiconductor production and processing equipment that prevents deformation, can solve problems such as pin or main body deformation, affecting product quality, etc., and achieve the effect of wide applicability

Active Publication Date: 2020-04-17
DATONG XINCHENG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above process, due to the operation, the length of the pins is different, and the pins need to be cut to make the length of the pins reach the specified standard. If the main body is not fixed during the cutting process, it is easy to cause deformation of the pins or the main body , which will ultimately affect the quality of the product, so design a semiconductor production and processing equipment that prevents deformation and its use method

Method used

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  • Semiconductor production and processing equipment capable of preventing deformation and using method thereof
  • Semiconductor production and processing equipment capable of preventing deformation and using method thereof
  • Semiconductor production and processing equipment capable of preventing deformation and using method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0035] Embodiment 1: see Figure 1-5 , a semiconductor production and processing equipment for preventing deformation, comprising a bottom plate 2, a top plate 3, a pole 4 and two sets of clamping assemblies, the bottom plate 2 and the top plate 3 are rectangular plates and arranged parallel to each other, the bottom plate 2 and The top boards 3 are fixed by poles 4, and the middle part of the bottom surface of the bottom board 2 and the middle part of the top surface of the top board 3 are equipped with rotating motors 6. Two groups of clamping assemblies are arranged symmetrically between the bottom board 2 and the top board 3, and the two clamps Tight assembly is all connected with the output shaft driving of rotating motor 6.

[0036] The clamping assembly includes a turntable 10, a first push rod 12, a mounting frame 15 and an adjustment mechanism. The middle part of the turntable 10 is drivingly coupled with the output shaft of the motor 6, and the side of the turntable ...

Embodiment 2

[0046] Example 2: see Image 6 , in this embodiment, a method of using equipment for semiconductor production and processing to prevent deformation, specifically includes the following steps:

[0047] Step 1: Normal power-on work, the motor 24 in the clamping assembly works, the driving gear 23 rotates, thereby driving the corresponding tooth plate 16 to slide along the extension direction of each end rod of the mounting bracket 15, and adjusting the position of each movable block 17, which is convenient Clamping semiconductor packages;

[0048] Step 2: basically place the semiconductor to be processed on each clamping rod 14 in the lower clamping assembly

[0049] The top surface of the first push rod 12 in the two clamping assemblies is pushed out, driving the two clamping assemblies closer together, when the end faces of the clamping rods 14 in the upper clamping assembly are pressed against the semiconductor package Just above.

[0050] Step 3: make the rotating motor 6...

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Abstract

The invention discloses semiconductor production and processing equipment capable of preventing deformation, which comprises a bottom plate, a top plate, a supporting rod and two groups of clamping assemblies. The bottom plate and the top plate are both in a rectangular plate shape and are arranged in parallel. The bottom plate and the top plate are fixed through the supporting rod. Rotating motors are mounted in the middle of the bottom surface of the bottom plate and the middle of the top surface of the top plate; the two groups of clamping assemblies are symmetrically arranged between the bottom plate and the top plate; the two clamping assemblies are in driving connection with an output shaft of the rotating motor; the clamping assembly comprises a rotary disc, a first push rod, a mounting frame and an adjusting mechanism, the middle of the rotary disc is in driving connection with an output shaft of the motor, the first push rod is fixed to the side, away from the output shaft ofthe motor, of the rotary disc, the mounting frame is fixed to a telescopic rod of the first push rod, and the mounting frame is of a cross structure. The structure is simple, the semiconductor packaging body is convenient to fix, and when pins on the periphery of a product are cut, the product is not prone to deformation.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a deformation-preventing semiconductor production and processing device and a method for using the same. Background technique [0002] At present, a semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, a diode is a device made of a semiconductor. A semiconductor is a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor. No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. The core units of most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arseni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/48
CPCH01L21/68792H01L21/68785H01L21/68764H01L21/4896
Inventor 王振国
Owner DATONG XINCHENG NEW MATERIAL CO LTD