Double-helix stepped forced vortex type liquid cooling radiator and processing method thereof
A technology of forced eddy current and double helix, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of semiconductor device power increase, reduce thermal resistance, improve service life and safety, and enhance The effect of compressive strength
Pending Publication Date: 2020-04-17
SHENZHEN ZHITONG ELECTRONICS CO LTD
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is: to overcome the deficiencies of the prior art, to provide a new generation of double-helix ladder forced eddy current liquid cooling radiator, and to solve the problem that the existing liquid cooling system of rail transit and power electronic equipment cannot adapt The problem of heat generation of semiconductor devices in existing power electronic equipment
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[0040] Figure 1 to Figure 4 It shows a preferred embodiment of the double-helix stepped forced vortex type liquid cooling radiator of the present invention, which includes an upper cover plate 001, a base plate 005 and a lower cover plate 007 fixed in sequence; the upper cover plate 001 and the lower cover plate 007 At least one of them is provided with a double-helix stepped groove 018, so that when the coolant flows through the double-helical stepped groove 018, it flows along a helical route and generates a forced vortex, forming one or two double-helical stepped forced vortex flow channels 016 One side of the substrate 005 is provided with a liquid flow inlet 013 and a liquid flow outlet 012, and a liquid return diversion hole 011 that runs through the top and bottom and communicates with the liquid flow outlet 012; the top and bottom of the substrate 005 are provided with The diversion groove 004 connected with the liquid inlet 013, the diversion groove 004 is sealed by ...
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The invention relates to a double-helix stepped forced vortex type liquid cooling radiator and a processing method thereof. The double-helix stepped forced vortex type liquid cooling radiator comprises an upper cover plate, a substrate and a lower cover plate which are sequentially fixed into a whole, wherein at least one of the upper cover plate and the lower cover plate is provided with a double-helix stepped groove, so that cooling liquid flows along a helix path and generates forced vortexes when flowing through the double-helix stepped groove, and one or two double-helix stepped forced vortex type liquid flow channels are formed; a liquid inlet and a liquid outlet are formed in one side of the substrate, and a liquid return flow guide hole which penetrates through the top and the bottom and is communicated with the liquid outlet is further formed in the substrate; flow guide grooves communicated with the liquid flow inlet are formed in the top and the bottom of the substrate, theflow guide grooves are sealed by flow guide groove sealing blocks, and liquid inlet flow guide holes are formed in the flow guide groove sealing blocks. By arranging the multi-layer double-helix stepped forced vortex type liquid flow channel, the heat dissipation area and the vortex effect are effectively enhanced, the temperature rise of the semiconductor device is greatly reduced, and the stability and the reliability of the semiconductor device are improved.
Description
technical field [0001] The invention relates to the technical field of heat sinks, and more specifically relates to a double-helix stepped forced eddy current liquid-cooled heat sink suitable for high-power thyristors and power electronic semiconductor devices and a processing method thereof. Background technique [0002] Power electronic equipment in modern power grids has further improved requirements for reliability, performance indicators, and power density, and the thermal design of power electronic equipment is becoming more and more important. Semiconductor devices are key devices in rail transit and power electronic equipment. The quality of their working status directly affects the reliability, safety and service life of the whole machine. In addition to effectively dissipating heat, the heat dissipation scheme of semiconductor devices also has is also crucial. [0003] Current semiconductor devices will generate conduction and switching losses during operation, so...
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IPC IPC(8): H01L23/473B23P15/26
CPCB23P15/26H01L23/473
Inventor 喻望春叶博森
Owner SHENZHEN ZHITONG ELECTRONICS CO LTD
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