A kind of microchannel heat sink and its manufacturing method

A heat sink and micro-channel technology, applied in the field of thermal management of semiconductor lasers, can solve the problems of insignificant heat dissipation, difficult technical realization, and limited application scenarios, and achieve the problems of reducing uneven distribution of heat sources, simple process, and increasing heat exchange area Effect

Active Publication Date: 2021-08-24
SHANGHAI JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Aiming at the problems of insignificant heat dissipation effect, limited application scenarios and technical implementation difficulties in the existing laser crystal heat dissipation technology, according to an embodiment of the present invention, a microchannel heat sink structure is provided, including:

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  • A kind of microchannel heat sink and its manufacturing method
  • A kind of microchannel heat sink and its manufacturing method
  • A kind of microchannel heat sink and its manufacturing method

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Embodiment Construction

[0053] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0054] In this specification, reference to "one embodiment" or "the...

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Abstract

The invention discloses a microchannel heat sink structure, comprising: a cover plate, the cover plate is provided with a working fluid inlet and a working medium outlet; a metal base, the metal base is sealed and arranged under the cover plate; a first micro The flow channel structure, the first micro flow channel structure is arranged inside the cover plate and the sealing body of the metal base along the first direction; the second micro flow channel structure, the second micro flow channel structure is arranged along the second The direction is set inside the cover plate and the sealing body of the metal base, and communicates with the first micro-channel structure, the working fluid inlet, and the working fluid outlet; and the micro-channel distribution structure, the The micro-channel distribution structure is arranged inside the cover plate and the sealing body of the metal base, and communicates with the first micro-channel structure.

Description

technical field [0001] The invention relates to the technical field of thermal management of semiconductor lasers, in particular to a locally strengthened microchannel heat sink for laser crystals in end-pumped slab lasers and a manufacturing method thereof. Background technique [0002] Laser technology is an important science and technology developed in the 20th century, and has been widely used in military, medical, material processing and other occasions. Among them, the laser diode pumped all-solid-state laser has the advantages of high efficiency, high reliability, and high beam therapy. These advantages are especially obvious in the end-pumped slab laser. However, due to the low thermal conductivity of the laser crystal in the end-pumped slab laser, the risk of thermal lens effect and thermal fracture damage largely limits the increase of laser power. Therefore, the heat dissipation of laser crystals has become an urgent problem to be solved. [0003] The article "T...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/024
CPCH01S5/024H01S5/02476
Inventor 郭展锋王艳丁桂甫王广元孙云娜吴永进
Owner SHANGHAI JIAOTONG UNIV
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