Film-shaped firing material and support-sheet-equipped film-shaped firing material
A support sheet and film-like technology, applied in the field of film-like firing materials, can solve problems such as poor thermal conductivity and hinder heat dissipation, and achieve the effects of suppressing chip defects, chip scattering, and wafer contamination
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no. 1 approach
[0146] The film-form fired material with a support sheet of this embodiment is equipped with the said film-form fired material and the support sheet provided in at least one side (surface) of the said film-form fired material. It is preferable that the support sheet is provided with an adhesive layer on the entire surface of the base film or on the outer peripheral portion, and the film-shaped fired material is provided on the adhesive layer. The film-like fired material may be provided so as to be in direct contact with the pressure-sensitive adhesive layer, or may be provided so as to be in direct contact with the base film. By employing this aspect, it can be used as a dicing sheet used when singulating a semiconductor wafer into chips. In addition, by singulating together with the semiconductor wafer using a blade, it is possible to process the film-shaped fired material having the same shape as the chip, and to manufacture a chip with the film-shaped fired material.
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no. 2 approach
[0173] The film-shaped fired material with a support sheet according to this embodiment includes a film-shaped fired material and a support sheet provided on at least one side (surface) of the film-shaped fired material, and the film-shaped fired material supports the support sheet. The adhesive force (a2) is less than the adhesive force (a1) of the film-like firing material to the semiconductor wafer, and the adhesive force (a1) is more than 0.1N / 25mm, and the adhesive force (a2) is 0.1N / 25mm or more and 0.5N / 25mm or less.
[0174] For example, in Figure 6 In the laminated body in which the film-shaped fired material with a support sheet of this embodiment and the semiconductor wafer are laminated, the adhesive force (a2) of the film-shaped fired material to the support sheet is smaller than that of the film-shaped fired material. Adhesion (a1) of the material to the semiconductor wafer, and the adhesion (a1) is 0.1N / 25mm or more, and the adhesion (a2) is 0.1N / 25mm or more...
Embodiment 1～3
[0259] "Examples 1-3, Comparative Examples 1-4"
[0260]
[0261] The components used to prepare the fired material composition are shown below. Here, the metal particles having a particle size of 100 nm or less are referred to as "sinterable metal particles".
[0262] (sintered metal particles enclosing paste material)
[0263] ・Alconano Ag Paste ANP-1 (organic coated composite silver nano paste, manufactured by NANOPARTICLE LABORATORY CORPORATION: silver particles covered with alcohol derivatives, silver particles (sintered metal particles) with a metal content of 70 mass % or more and an average particle diameter of 100 nm or less 60% by mass or more)
[0264] ・Alconano Ag Paste ANP-4 (organic coated composite silver nano paste, manufactured by NANOPARTICLE LABORATORY CORPORATION: silver particles covered with alcohol derivatives, silver particles (sintered metal particles) with a metal content of 80 mass % or more and an average particle diameter of 100 nm or less 25%...
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Abstract
Description
Claims
Application Information
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