Integrated packaging structure and packaging method of surface acoustic wave sensor

Abstract

The invention provides an integrated packaging structure of a surface acoustic wave sensor. An insulating protective layer covers a busbar and a wire on the upper surface of a sensor substrate; a bonding pad plating layer covers the upper surface of an external bonding pad port of the sensor; the metal support frame has a certain height and grows on the sensor substrate and the insulating protective layer; a metal cover plate grows on the metal support frame to form a metal protective layer; and a gold crystal bonding layer grows on the back surface of the sensor substrate to form an elastic metal layer. Meanwhile, the invention provides a packaging method of the packaging structure. According to the invention, the sensitive substrate and the package of the sensor are integrally manufactured and glue does not need to be spin-coated on the structure for bonding, so that the reliability of the surface acoustic wave sensor packaging structure is improved, the defects of large clutter andlarge characteristic change after packaging in traditional packaging are overcome; meanwhile, the integrated packaging structure can be applied to detection of various information such as temperature,pressure and stress/strain.

Description

technical field [0001] The invention relates to the technical field of sensor packaging, in particular to an integrated packaging structure and packaging method of a surface acoustic wave sensor. Background technique [0002] The surface acoustic wave sensor is a kind of wireless passive sensor that uses surface acoustic wave devices as sensitive components, and can reflect the measured physical quantity through the change of the speed or frequency of surface acoustic waves, and output it as a radio frequency electrical signal. Accurately measure a large number of physical and chemical quantities, such as temperature, stress, pressure, density, etc., especially for the detection of high-speed rotation, petrochemical, high temperature, nuclear radiation, strong electromagnetic field and other environments. In recent years, microelectronics technology, microwave technology and other related electronic technologies have developed rapidly with each passing day, providing a techn...

AI Technical Summary

Problems solved by technology

Therefore, this structure does not take into account factors such as the process feasibility and test reliability of the surface acoustic wave sensor. At the same time, the packaging device of the surface acoustic wave sensor is not truly integrated, and the packaging requires multiple steps to complete, which is not conducive to Rapid Deployment Installation and Testing of SAW Sensors

[0005] At present, there is no description or report of the similar technology of the present invention, and no similar data at home and abroad have been collected yet.

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