Temperature difference control system and method for test board, test frame and highly accelerated stress test

Abstract

The application discloses a test board, a test rack, and a temperature difference control system and method for high-accelerated stress testing. The test board includes: a substrate and a plurality of sample slots distributed in an array on the substrate. The pins and the sample card slot are used to load the sample to be tested, the sample card slot is provided with a heat dissipation assembly, the heat dissipation assembly is located on the surface of the sample to be tested away from the sample card slot, and the heat dissipation assembly is fixed on the sample card slot by a screw; the test frame It includes a first connection part, a second connection part and a test board which are perpendicular to each other. The test board and the test frame disclosed by the application can balance the temperature of the product, reduce the temperature difference between the chip temperature and the ambient temperature of the test chamber, truly simulate the working state of the sample in the experimental environment, and find design and process failures in time; the control method disclosed by the application can Real-time monitoring of the temperature difference between the test sample and the test chamber does not require manual monitoring and adjustment of the temperature difference, further ensuring the true simulation of product failure status.

Description

technical field [0001] The invention generally relates to the technical field of semiconductor testing, and in particular to a test board, a test frame, and a temperature difference control system and method for highly accelerated stress testing. Background technique [0002] Reliability test item - high accelerated stress test is to apply high temperature, high humidity and high pressure environment to semiconductor packaging products, and at the same time load the product with a suitable working voltage, and accelerate the intrusion of moisture into the product under the working state of the simulated product to generate ions Migration effect, so as to accelerate the discovery and positioning of product design and process defects, provide a strong basis for product design and improvement, shorten the test cycle, and thus make the product design and manufacturing process before putting into production or at the end customer site There are very few design and process-related...

AI Technical Summary

Problems solved by technology

However, for products with high power consumption, a large amount of heat will be generated during the test process of loading the working voltage to simulate the working state. The internal temperature of the chip and the ambient temperature of the test box exceed 5°C or even 10°C, and the heat generated by power dissipation will dissipate the surface of the chip. The surrounding moisture that is closely related to the failure mechanism prevents the intrusion of moisture into the sample, resulting in the inability to simulate the real state of the sample failure caused by the test, thus affecting the accuracy of the reliability test and laying a solid foundation for the quality of subsequent mass production. Hidden danger

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