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Method for manufacturing substrate with electrodes formed thereon

A manufacturing method and electrode substrate technology, which is applied in cable/conductor manufacturing, chemical instruments and methods, circuits, etc., can solve problems such as poor moiré ripples and position offsets, and achieve the effects of suppressing moiré ripples and excellent positional accuracy

Pending Publication Date: 2020-05-08
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the transparent substrate on which the opaque wiring electrodes are formed is bonded to two or more layers or to other substrates, there is a tendency for the mechanical precision of the bonding device and the flexibility of the adhesive member for bonding to cause damage. Offset subject
In particular, when two or more layers of transparent substrates on which opaque wiring electrodes are formed are laminated, if positional displacement occurs, moiré defects due to interference between opaque wiring electrodes will occur.

Method used

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  • Method for manufacturing substrate with electrodes formed thereon
  • Method for manufacturing substrate with electrodes formed thereon
  • Method for manufacturing substrate with electrodes formed thereon

Examples

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Embodiment

[0083] Hereinafter, examples are given to illustrate the present invention in further detail, but the present invention is not limited to these.

[0084] The materials used in each example are as follows. In addition, the transmittance of the transparent substrate at a wavelength of 550 nm was measured using an ultraviolet-visible spectrophotometer (U-3310 (made by Hitachi High-Technology Co., Ltd.)).

[0085] (Transparent substrate)

[0086] · "ルミラー" (registered trademark) T60 (manufactured by Toray Co., Ltd.) (thickness: 100 μm, transmittance at wavelength 550 nm: 89%) (a-1)

[0087] · "Seomex" (registered trademark) 480 (manufactured by Nippon Konon Co., Ltd.) (thickness: 100 μm, transmittance at a wavelength of 550 nm: 92%) (a-2).

manufacture example 1

[0088] (Production Example 1: Acrylic copolymer containing carboxyl group)

[0089] 150 g of diethylene glycol monoethyl ether acetate (hereinafter, "DMEA") was added to a reaction vessel in a nitrogen atmosphere, and the temperature was raised to 80°C using an oil bath. To this was added dropwise over 1 hour from 20 g of ethyl acrylate (hereinafter, "EA"), 40 g of 2-ethylhexyl methacrylate (hereinafter, "2-EHMA"), and 20 g of styrene (hereinafter, " St"), 15 g of acrylic acid (hereinafter, "AA"), 0.8 g of 2,2-azobisisobutyronitrile, and 10 g of diethylene glycol monoethyl ether acetate. After completion of the dropwise addition, it was further stirred for 6 hours to proceed the polymerization reaction. Then, 1 g of hydroquinone monomethyl ether was added to stop the polymerization reaction. Next, a mixture composed of 5 g of glycidyl methacrylate (hereinafter, "GMA"), 1 g of triethylphenylammonium chloride, and 10 g of DMEA was added dropwise over 0.5 hours. After the dropwis...

manufacture example 2

[0090] (Manufacturing Example 2: Photosensitive conductive paste)

[0091] In a 100 mL clean bottle, 17.5 g of the carboxyl group-containing acrylic copolymer obtained in Production Example 1, 0.5 g of photopolymerization initiator N-1919 (manufactured by ADEKA), and 1.5 g of epoxy resin "Adeka Rejin" (Registered trademark) EP-4530 (epoxy equivalent 190, manufactured by ADEKA), 3.5 g of monomer "Rait Acryret" (registered trademark) BP-4EA (manufactured by Kyoeisha Chemical Co., Ltd.) and 19.0 g DMEA was mixed by using "Kawatori Taro" (registered trademark) ARE-310 (manufactured by Shinke Co., Ltd.) to obtain 42.0 g of a resin solution. The 42 g of the resin solution obtained was mixed with 62.3 g of silver particles with a primary particle size of 0.4 μm. After kneading with a three-roll EXAKT M50 (manufactured by EXAKT), 7 g of DMEA was further added and mixed to obtain 111 g of photosensitive conductive material. paste. The viscosity of the photosensitive conductive paste is ...

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Abstract

Provided is a method for manufacturing a substrate with electrodes formed thereon, wherein positional accuracy is excellent even when a thin film transparent substrate that is difficult to see is used, transmittance differences and moire can be suppressed, and yield is high. This method for manufacturing a substrate with electrodes formed thereon in which a first electrode, an insulating layer, and a second electrode are formed on a first transparent substrate having a thickness of no greater than 200 [mu]m comprises: a step for forming the first electrode on at least one surface of the firsttransparent substrate; a step for forming the insulating layer on the surface on which the first electrode of the transparent substrate is formed; and a step for forming the second electrode on the insulating layer, wherein the first electrode and / or the second electrode are opaque.

Description

Technical field [0001] The present invention relates to a method for manufacturing an electrode-equipped substrate having a transparent substrate, a first electrode, an insulating layer and a second electrode. Background technique [0002] In recent years, touch panels have been widely used as input means. The touch panel is composed of a display unit such as a liquid crystal panel and a touch panel sensor that detects information input to a specific location. The touch panel method is roughly classified into a resistive film method, an electrostatic capacitance method, an optical method, an electromagnetic induction method, an ultrasonic method, etc. according to the method of detecting an input position. Among them, for reasons such as optically bright, excellent design, simple structure, and excellent functionality, capacitive touch panels are widely used. [0003] The capacitive touch panel sensor has a vertical second electrode via a first electrode and an insulating layer. ...

Claims

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Application Information

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IPC IPC(8): G06F3/041B32B7/02B32B37/00G06F3/044H01B13/00
CPCB32B7/02B32B37/00G06F3/041H01B13/00G06F3/0445B32B7/025B32B37/12H01B5/14H01B13/0016G06F2203/04103
Inventor 桥本大树高濑皓平
Owner TORAY IND INC
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