MEMS diaphragm and MEMS sensor chip

A diaphragm and sensing part technology, applied in piezoelectric devices/electrostrictive devices, semiconductor/solid-state device components, piezoelectric/electrostrictive/magnetostrictive devices, etc. control of film stress, low sensitivity of MEMS devices, etc.
CN111137842AActive Publication Date: 2020-05-12SHANDONG GETTOP ACOUSTIC
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHANDONG GETTOP ACOUSTIC
Publication Date
2020-05-12

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Abstract

The invention provides an MEMS diaphragm and an MEMS sensor chip. The MEMS diaphragm comprises a sensing part and a peripheral part surrounding the periphery of the sensing part. A plurality of outergrooves and a plurality of inner grooves are formed between the peripheral part and the sensing part; the plurality of outer grooves are annularly distributed at the inner edge of the peripheral part;a first connecting arm is formed between every two adjacent outer grooves, the multiple inner grooves are annularly distributed in the outer edge of the sensing part, a second connecting arm is formed between every two adjacent inner grooves, and at least one of the first connecting arms and the second connecting arms is provided with a reinforcing rib structure.
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Description

technical field

[0001] The invention relates to the technical field of micro-electromechanical systems (MEMS, Micro-Electro-Mechanical System), in particular to a MEMS diaphragm and a MEMS sensor chip including the MEMS diaphragm. Background technique

[0002] Micro-electromechanical sensors are widely used in various acoustic receivers or force sensors. Their small size, low power consumption, and high sensitivity have become design goals. According to the results of theoretical simulations, the influence of residual stress on sensors The mechanical sensitivity of the diaphragm in the vibrating film has a great influence.

[0003] The capacitive sensor structure included in the MEMS device is generally a sensing film and a back electrode, forming a two-parallel capacitive plate structure to sense vibration or pressure change. Among them, the material properties of the sensing film determine the sensitivity performance of the component, but the thermal residual stress gener...

Claims

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