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Modified PTFE composite dielectric material as well as preparation method and application thereof

A technology of composite media and composite materials, which is applied in the field of modified PTFE composite materials, can solve the problems of high thermal expansion coefficient of PTFE, inability to obtain dielectric constant at the same time, and increase of dielectric constant, so as to achieve low dielectric constant and improve thermal expansion coefficient. Good, the effect of preventing the increase of dielectric loss

Inactive Publication Date: 2020-05-15
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In view of the high thermal expansion coefficient of PTFE, the introduction of ceramic filling will lead to an increase in the dielectric constant, and it is impossible to simultaneously obtain a PTFE composite dielectric plate containing ceramic fillers with low dielectric constant and low thermal expansion coefficient. The present invention provides a modified PTFE composite Dielectric material, which uses non-solid ceramic particles to fill modified PTFE to form a composite dielectric material, which can solve this problem

Method used

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  • Modified PTFE composite dielectric material as well as preparation method and application thereof
  • Modified PTFE composite dielectric material as well as preparation method and application thereof
  • Modified PTFE composite dielectric material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] (1) Emulsion preparation: the hollow SiO 2 The ball and the PTFE emulsion are mixed, and double-center stirring is performed to control the ceramic particles to account for 10% of the total volume. The double-center stirring speed is 2000r / min, and the stirring time is 60s to obtain the emulsion for the PTFE composite dielectric plate containing ceramic fillers;

[0042] (2) Preparation of mud balls: add absolute ethanol with 50wt% of the emulsion quality to the emulsion obtained by mixing to carry out double-center stirring and demulsification, control the double-center stirring speed to be 800r / min, and control the double-center stirring time to be 50s to obtain ceramic-containing Mud balls for composite media boards filled with fillers;

[0043] (3) Calendering forming: The composite medium plate containing ceramic filler obtained by demulsification is pressed into a sheet by a calendering machine with mud balls. During the calendering process, the rotation speed of ...

Embodiment 2

[0049] Hollow SiO 2 Ball content is improved to 20%, and other raw materials and method steps, process parameter are identical with embodiment 1.

Embodiment 3

[0051] Hollow SiO 2 Ball content is improved to 30%, and other raw materials and method steps, process parameter are identical with embodiment 1.

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Abstract

The invention relates to a ceramic modified PTFE composite dielectric material with low dielectric constant and low thermal expansion. The PTFE composite material comprises PTFE and non-solid ceramicparticles, wherein the use amount of the non-solid ceramic particles is 1-60% of the overall volume fraction of the composite material, the dielectric constant of the modified PTFE composite dielectric material is 2.0-2.5, and the thermal expansion coefficient is 40-120 ppm / DEG C. The modified PTFE composite dielectric material has a low dielectric constant and a low thermal expansion coefficient.

Description

technical field [0001] The invention relates to a modified PTFE composite material, in particular to a ceramic-modified low dielectric constant and low thermal expansion PTFE composite dielectric material and a preparation method thereof, which are applied to the manufacture of circuit boards, especially 5G high-frequency circuit boards. Background technique [0002] As 5G mobile communication technology matures and continues to spread, mobile terminals such as smartphones, smart watches, and tablet computers have entered a new round of rapid development as electronic products supporting 5G, and the printed circuit boards (PCBs) used in them have also followed suit. Entering a new period of development opportunities. This requires the circuit board to have high density, high frequency and high speed, high heat generation and other properties. [0003] The dielectric constant determines the speed at which electrical signals propagate in the medium. The lower the dielectric c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K7/26
CPCC08K7/26C08K2201/003C08L2203/20C08L27/18
Inventor 周静韩坤昆沈杰祁琰媛李强志陈文
Owner WUHAN UNIV OF TECH
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