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Heat-dissipating single/dual fiber pluggable optical module and its assembly method, outer clip fastener

A heat-dissipating, optical module technology, used in optical components, optics, light guides, etc., can solve the problems of damage to the internal chip components of the optical module, performance degradation, and disability of the optical module, and achieve the effect of excellent external heat conduction effect.

Active Publication Date: 2020-11-03
SHENZHEN OPTIC KING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The main purpose of the present invention is to provide a heat-dissipating single / dual-fiber pluggable optical module, which is used to solve the problem of excessive heat generation and damage to the internal chip device of the optical module under the high-speed optical signal transceiver operation processing of the optical module, or cause the performance of the optical module to deteriorate. , the problem of disability

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  • Heat-dissipating single/dual fiber pluggable optical module and its assembly method, outer clip fastener
  • Heat-dissipating single/dual fiber pluggable optical module and its assembly method, outer clip fastener
  • Heat-dissipating single/dual fiber pluggable optical module and its assembly method, outer clip fastener

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Embodiment Construction

[0062] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only part of the embodiments for understanding the inventive concepts of the present invention, and cannot represent All the embodiments are not explained as the only embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art on the premise of understanding the inventive concepts of the present invention fall within the protection scope of the present invention.

[0063] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the sp...

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Abstract

The invention relates to a heat-dissipating single / dual-fiber pluggable optical module, its assembly method, and an outer fastener. The optical module includes: a shell cover, a module circuit board, a base, and an outer fastener; the side of the module circuit board The sides are clamped and fixed between the shell cover and the base to form two heat convection channels on the upper and lower sides of the module circuit board. The heat conduction bosses in the shell cover and the outer clips with a specific structure are used to thermally couple the heat conduction bosses. The chip heating body, the outer clip is attached to the shell cover in a heat-conducting manner, and the base is fastened in a heat-conducting manner to establish a heat conduction path from the heat-conducting boss to the base through the outer clip fastener, which is a bad path around the two heat convection channels, improving The air-cooled heat dissipation performance of single / dual-fiber pluggable optical module products is suitable for high-speed communication data transmission.

Description

technical field [0001] The invention relates to the technical field of single / dual-fiber pluggable optical modules, in particular to a heat-dissipating single / dual-fiber pluggable optical module, an assembly method thereof, and an outer clip fastener. Background technique [0002] Single / dual-fiber pluggable optical modules are small pluggable transceiver devices containing active chips and optical receiver transmitters, used in high-speed telecommunications and data communications, in order to match 4G, 5G, 6G or more advanced wireless communication protocols The amount of data that needs to be transmitted within a limited time is also increasing. With the increase of transmission rate, such as 622Mb / s, 2.5Gb / s, 5Gb / s, or even 10G / s or higher, the heat generated by the internal chip is getting higher and higher. There are many, and the damage to the optical communication performance or / and the assembly structure is also increasing, such as communication signal distortion, c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4256G02B6/426G02B6/4267G02B6/4268
Inventor 刘萍刘平刘松彭彦辉刘斌
Owner SHENZHEN OPTIC KING TECH