Sub-module redundancy configuration method and system of modular multilevel converter

A modular multi-level, redundant configuration technology, applied in the direction of output power conversion devices, electrical components, etc., can solve the problems of underutilization of redundant modules, overvoltage damage of capacitive equipment, etc., to enhance fault ride-through capacity, reducing the harmonic content of the output voltage, the effect of reducing the loss

Inactive Publication Date: 2020-05-29
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides a sub-module redundant configuration method and system of a modular multi-level converter, which solves the problem of excessive capacitive equipment caused by the total input power of the system being greater than its output power in the prior art. Crash damage and underutilization of redundant modules

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  • Sub-module redundancy configuration method and system of modular multilevel converter
  • Sub-module redundancy configuration method and system of modular multilevel converter
  • Sub-module redundancy configuration method and system of modular multilevel converter

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Embodiment 1

[0041] An embodiment of the present invention provides a sub-module redundant configuration method for a modular multilevel converter, such as figure 1 shown, including the following steps:

[0042] Step S1: Determine the number of faulty sub-modules in the modular multilevel converter.

[0043] In the embodiment of the present invention, such as figure 2 As shown, a single bridge arm of a modular multilevel converter contains hundreds of power sub-modules, and the structure of the sub-modules can be divided into three types: half H-bridge, full H-bridge and double-clamped sub-modules. , once a sub-module fails, the bypass switch will act to remove the faulty sub-module, and then put the redundant module into operation instead of the faulty module. The system can detect the faulty module through the fault detector. If the sub-module fails, the fault The detector adds 1 to the statistics of faulty sub-modules, and feeds back the statistical results to the system to determine...

Embodiment 2

[0079] An embodiment of the present invention provides a sub-module redundant configuration system of a modular multilevel converter, such as Figure 10 shown, including:

[0080] The module 1 for determining the number of faulty sub-modules is used to determine the number of faulty sub-modules in the modular multilevel converter; this module executes the method described in step S1 in Embodiment 1, which will not be repeated here.

[0081] The calculation module 2 is used to calculate the capacitor reference voltage of the sub-modules of the modular multilevel converter based on the number of faulty sub-modules; this module executes the method described in step S2 in Embodiment 1, which will not be repeated here .

[0082] The obtaining module 3 is used to obtain the target output voltage of the upper bridge arm and the target output voltage of the lower bridge arm of the modular multilevel converter; this module executes the method described in step S3 in Embodiment 1, and ...

Embodiment 3

[0086] An embodiment of the present invention provides an electronic device, such as Figure 11 As shown, it includes: at least one processor 401 , such as a CPU (Central Processing Unit, central processing unit), at least one communication interface 403 , memory 404 , and at least one communication bus 402 . Wherein, the communication bus 402 is used to realize connection and communication between these components. Wherein, the communication interface 403 may include a display screen (Display) and a keyboard (Keyboard), and the optional communication interface 403 may also include a standard wired interface and a wireless interface. The memory 404 may be a high-speed RAM memory (Ramdom Access Memory, volatile random access memory), or a non-volatile memory (non-volatile memory), such as at least one disk memory. Optionally, the memory 404 may also be at least one storage device located away from the aforementioned processor 401 . The processor 401 can execute the submodule ...

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Abstract

The invention discloses a sub-module redundancy configuration method and system of a modular multilevel converter. The method comprises the following steps: determining the number of fault sub-modulesin the modular multilevel converter; calculating and acquiring a capacitance reference voltage of the sub-modules of the modular multilevel converter based on the number of the fault sub-modules; obtaining a target output voltage of an upper bridge arm and a target output voltage of a lower bridge arm of the modular multilevel converter; and determining the number of sub-modules input by the upper bridge arm by utilizing the capacitance reference voltage and the target output voltage of the upper bridge arm, and determining the number of sub-modules input by the lower bridge arm by utilizingthe capacitance reference voltage and the target output voltage of the lower bridge arm. In the invention, a maximum voltage output capability is reserved by increasing a capacitor voltage so that thesystem operates stably, and a fault ride-through capability is enhanced; and loss of a converter valve is reduced, redundant modules are fully utilized, a harmonic content of an output voltage is reduced, and operation performance of the modular multilevel converter is optimized.

Description

technical field [0001] The invention relates to the field of flexible direct current transmission, in particular to a submodule redundant configuration method and system of a modular multilevel converter. Background technique [0002] Modular multilevel converter (MMC) has the advantages of high modularity, low switching frequency, low harmonic content, flexible and independent control of active and reactive power, etc., and has a wide range of applications in the field of medium and high voltage direct current transmission. , is an important technical solution for building future power grids and delivering clean energy. [0003] A single bridge arm of high-voltage and large-capacity MMC contains hundreds of power sub-modules, and the output voltage of the bridge arm is superimposed by the output voltage of each sub-module. For redundant sub-modules, once a sub-module fails, the bypass switch will cut it off, and then put the redundant module into operation instead of the f...

Claims

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Application Information

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IPC IPC(8): H02M1/32
CPCH02M1/32H02M1/325
Inventor 许彬李景波宁志彦王高勇周军川
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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