Method for preparing two-dimensional material anti-scaling layer

A technology of two-dimensional materials and anti-scaling layer, which is applied in the direction of metal material coating process, coating, gaseous chemical plating, etc., can solve the problems of large use limitation, high cost, and reduction, and achieve the reduction of scaling rate, The effect of improving anti-corrosion performance

Inactive Publication Date: 2020-06-02
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The former has a better anti-scaling effect, but there are problems such as high cost and limited use.
The anti-scaling effect of the latter is relatively poor, and it will decrease significantly with the prolongation of use time.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] In this embodiment, copper with different shapes is used as the substrate, and a graphene film is grown on the surface as the anti-fouling layer. First, place the copper substrate in a high-temperature reaction furnace, heat it to 1000°C, and then pass methane (flow rate 1-50 sccm) as a reaction gas. After reacting for 5-30 minutes, a graphene film is formed on the surface through a chemical gas phase process as an anti-scaling layer, and take it out after cooling, the average thickness of the anti-fouling layer of the obtained two-dimensional material is 0.3-1 nanometer, and its fouling rate is 30 grams / square meter.

Embodiment 2

[0021] The difference from Example 1 is:

[0022] In this embodiment, a fluorinated graphene film is used as the anti-fouling layer. Place the copper substrate with graphene growing on the surface in xenon fluoride gas, and treat it for 20-60 minutes, and the graphene can be completely or partially converted into the fluorinated graphene anti-fouling layer. The average value of the obtained two-dimensional material anti-fouling layer The thickness is 1-2 nanometers, and the fouling rate is 25 g / m2.

Embodiment 3

[0024] The difference from Example 1 is:

[0025] In this embodiment, copper is replaced by a substrate such as magnesium alloy, aluminum alloy, etc., and a graphene film is grown on the surface as an anti-fouling layer by using plasma-assisted chemical vapor deposition technology. First, the substrate is placed in a plasma-assisted chemical vapor deposition system, heated to 300-600° C., and methane (flow rate 5-200 sccm) is introduced as a reaction gas. After reacting for 5-10 minutes, a graphene film is formed on its surface, and the obtained The average thickness of the antifouling layer of the two-dimensional material is 2 to 10 nanometers, and its fouling rate is 20 grams / square meter.

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Abstract

The invention relates to the technical field of preparation of anti-scaling layers, in particular to a method for preparing a two-dimensional material anti-scaling layer in a heating growth mode. Themethod is suitable for scale prevention of different substrate materials and devices. The growth method is adopted, a substrate is heated to the reaction temperature, and then the two-dimensional material anti-scaling layer is formed on the surface of the substrate through the reaction of a precursor. According to the method, the characteristics of high intrinsic atomic-scale surface flatness andhigh surface chemical inertness of the grown two-dimensional material are fully utilized to prepare the high-performance anti-scaling layer, so that the scaling rate of the surface of the substrate material is remarkably reduced. The method also can adopt the two-dimensional material with the high barrier property, and meanwhile, the corrosion resistance of the substrate material is improved.

Description

Technical field: [0001] The invention relates to the technical field of preparation of an anti-scaling layer, in particular to a method for preparing a two-dimensional material anti-scaling layer by heating and growing, which is suitable for anti-scaling of different base materials and devices. Background technique: [0002] Fouling is a common problem in heat exchangers, pipes, cooling towers, water tanks and other equipment, mainly including scale and biological slime. Scaling not only seriously reduces the heat exchange efficiency of equipment, but also may shorten the service life of equipment and materials due to uneven heating, and even cause direct damage to heated materials. At present, anti-fouling agents and anti-fouling coatings are mainly used to alleviate the fouling problem. The former has a better anti-scaling effect, but there are problems such as high cost and large use limitations. The anti-scaling effect of the latter is relatively poor, and it will decr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/26C23C16/30C23C16/34C23C16/44C23C16/513C23F15/00
CPCC23C16/26C23C16/513C23C16/44C23C16/342C23C16/30C23F15/005
Inventor 马来鹏任文才成会明
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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