Blind hole filling electroplating copper solution and application thereof

Abstract

The invention provides a blind hole filling electroplating copper solution. The electroplating copper solution comprises the components of 40g / L to 120g / L of sulfuric acid, 120g / L to 240g / L of coppersulfate pentahydrate, 40ppm to 80ppm of chloride ions, 0.2ml / L to 2ml / L of an accelerator, 10ml / L to 30ml / L of an inhibitor, and 1ml / L to 10ml / L of a leveling agent. The leveling agent is an aqueous solution formed by mixing isonicotinic acid compounds and oligomeric quaternary ammonium compounds according to the mass ratio of 1 to 2 or 2 to 1. The solute concentration of the leveling agent is 10g / L. Because of the mutual collaborative mating action between the isonicotinic acid compounds and oligomeric quaternary ammonium compounds in the leveling agent and the other components in the electroplating copper solution, the blind hole filling electroplating process is taken under effective control, it is achieved that the surfaces of filled blind holes are good in smoothness, and sunken partsor protruding parts on the surfaces of hole ports of the filled blind holes are smaller than 5 microns in size.

Description

technical field [0001] The invention relates to the technical field of circuit board electroplating, in particular to a blind hole filling electroplating copper solution and application thereof. Background technique [0002] In recent years, with the rapid development of electronic industry technology, many electronic products must not only have powerful functions, but also have good portability, so the volume of electronic products is getting smaller and smaller, and the functions are more and more concentrated. As the mother of electronic products, the circuit board must increase the circuit density as much as possible to save limited space, so it is an inevitable trend to refine and thin the circuit board. In order to make the PCB accommodate more components while reducing its size and weight, the circuit board is constantly decreasing in terms of wire width, line spacing, hole diameter and hole spacing, and the thickness of the conductor layer and insulating layer. . T...

AI Technical Summary

Problems solved by technology

However, the existing electroplating additives used for filling traditional HDI blind holes often have certain depressions or protrusions on the surface of the filled blind holes, generally 5-10 microns, and even 15 microns at the maximum, and the flatness cannot be fully satisfied. In order to improve the quality of such substrates, it is necessary to develop high planarity additive products that meet the blind hole filling requirements of substrates.

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