Cu BALL, OSP-TREATED Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND FOAM SOLDER, AND METHOD FOR MANUFACTURING Cu BALL

Abstract

Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the solder bump 30 of a semiconductor chip 10 and the electrode 41 of a printed board 40 with solder pastes 12 and 42. The solder bump 30 is formed by bonding a Cu ball 20 to the electrode 11 of the semiconductor chip 10. The Cu ball 20 has a purity of 99.995-99.9995% by mass, and the total amount of at least one of Fe, Ag and Ni is 5.0-50.0 mass ppm. The amount ofS is 1.0 mass ppm or less, and the amount of P is less than 3.0 mass ppm.

Description

technical field [0001] The invention relates to Cu balls, OSP-treated Cu balls, Cu core balls, brazing joints, solder paste, shaped solder and methods for manufacturing Cu balls. Background technique [0002] In recent years, due to the development of small information equipment, the electronic components mounted therein are rapidly miniaturized. In response to the demand for miniaturization of electronic components, a ball grid array package (hereinafter referred to as "BGA") with electrodes provided on the rear surface is being used in order to cope with the reduction in the size of connection terminals and the reduction in mounting area. [0003] Among the electronic components using BGA, there is, for example, a semiconductor package. In the semiconductor package, a semiconductor chip having electrodes is sealed with resin. Solder bumps are formed on electrodes of the semiconductor chip. The solder bumps are formed by bonding solder balls to electrodes of the semicond...

AI Technical Summary

Problems solved by technology

However, if the purity of Cu balls is increased, the sphericity of Cu balls will become lower

[0007] If the sphericity of the Cu ball is low, the self-alignment when the Cu ball is mounted on the electrode may not be ensured, and the height of the Cu ball may become uneven during semiconductor chip mounting, which may cause bonding failure

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