Special protection circuit in silicon carbide diode chip
A technology of silicon carbide diodes and protection circuits, applied in emergency protection circuit devices, emergency protection circuit devices for limiting overcurrent/overvoltage, circuits, etc., can solve the problem of increasing the complexity of the structure of the protection circuit, potential safety hazards, There are problems such as electromagnetic interference to achieve the effect of avoiding high voltage breakdown, improving protection performance, and preventing electromagnetic interference
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Embodiment 1
[0024] refer to figure 1 , a dedicated protection circuit in a silicon carbide diode chip, including a package shell (1), a group of chips 2 located in the package shell 1, and leads 3 connected to both ends of the package shell 1, and the package shell 1 is made of black glue , the chip is provided with a silicon carbide diode 4 and a protection circuit 5, the protection circuit 5 includes an inductance 51 and a capacitor 52, and the protection circuit 5 formed by the inductance 51 and the capacitor 52 in series is connected in parallel with the silicon carbide diode 4; Due to the influence of space size and heat dissipation performance, the capacitor 52 and the resistor 53 are sheet or printed structures; the inductor 51 can be a separate lead inductor, or a serpentine lead that is depicted and printed on the chip.
Embodiment 2
[0026] refer to figure 2 , a special protection circuit in the silicon carbide diode chip, including a package shell 1, a group of chips 2 located in the package shell 1, and leads 3 connected to both ends of the package shell 1. The package shell 1 is made of black glue, and the said package shell 1 is made of black glue. The chip is provided with a silicon carbide diode 4 and a protection circuit 5. The protection circuit 5 includes an inductor 51, a capacitor 52 and a resistor 53. The resistor 53 is connected in parallel with the capacitor 52, and then connected in series with the inductor 51; the protection circuit 5 is connected to the silicon carbide. The diode 4 is connected in parallel; the capacitor 52 and the resistor 53 are sheet or printed structures according to the influence of the internal space and heat dissipation performance; the inductor 51 can be a separate lead inductor, or a serpentine lead drawn and printed on the chip.
[0027] This embodiment and the ...
Embodiment 3
[0029] refer to image 3 , a special protection circuit in the silicon carbide diode chip, including a package shell 1, a group of chips 2 located in the package shell 1, and leads 3 connected to both ends of the package shell 1, and the package shell 1 is made of black glue; the said package shell 1 is made of black glue; There is a common cathode in the chip and two silicon carbide diodes 4 are arranged in parallel. Each silicon carbide diode 4 is connected in parallel with a protection circuit 5. The protection circuit 5 includes an inductor 51, a capacitor 52 and a resistor 53. The resistor 53 is connected to the capacitor. 52 is connected in parallel, and then connected in series with the inductor 51; the protection circuit 5 is connected in parallel with the silicon carbide diode 4; specifically: the silicon carbide diode 4 includes a silicon carbide diode D1 and a silicon carbide diode D2, and the silicon carbide diode D1 is connected with the inductor L1, the capacitor ...
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