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Non-cyanide sulfite system gold electroplating solution and electroplating method

A cyanide-free sulfite and gold sulfite technology is applied in the field of cyanide-free sulfite system gold electroplating and electroplating, which can solve the problems of poor stability of the plating solution and difficulty in electroplating thick layers, and achieve stable properties and high cathode current. The effect of high density and gold content

Pending Publication Date: 2020-07-14
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the sulfite system electroplating gold is researched the most and has the best application prospects. This system has the disadvantages of poor stability of the plating solution and difficult electroplating thick coatings, so a kind of cyanide-free sulfite system electroplating gold solution and Electroplating gold method to solve the above problems

Method used

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specific Embodiment approach 1

[0028] Specific embodiment 1: the content of the gold sulfite is 10-30g / L in terms of gold element, the alkali metal sulfite is 100-250g / L, the citrate is 80-150g / L, the Phosphate 30-60g / L, the conductive salt 100-160g / L, the masking agent 10-30g / L, the organic additive 0.5-1g / L and the organic amine 5-10mL / L.

specific Embodiment approach 2

[0029] Specific embodiment 2: the content of the gold sulfite in terms of gold element is 15-25g / L, the alkali metal sulfite is 130-220g / L, the citrate is 100-130g / L, the Phosphate 35-55g / L, the conductive salt 110-150g / L, the masking agent 15-25g / L, the organic additive 0.6-0.9g / L and the organic amine 5-10mL / L.

specific Embodiment approach 3

[0030] Specific embodiment 3: the content of the gold sulfite in terms of gold element is 18-22g / L, the alkali metal sulfite is 150-200g / L, the citrate is 110-120g / L, the Phosphate 40-50g / L, the conductive salt 120-140g / L, the masking agent 20-24g / L, the organic additive 0.8-0.9g / L and the organic amine 5-10mL / L.

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Abstract

The invention provides a non-cyanide sulfite system gold electroplating solution and electroplating method. The non-cyanide sulfite system gold electroplating solution consists of gold sulfite, alkalimetal sulfite, citrate, phosphate, conducting salt, a masking agent, organic additives and organic amine. The electroplating method includes the following steps: S1, regulating a pH value of the non-cyanide sulfite system gold electroplating solution by utilizing the organic amine; S2, employing a pulse DC power supply constant current way to obtain a gold electroplated layer. The non-cyanide sulfite gold electroplating solution provided by the invention has high gold content, simple components, a stable property, a small fluctuation range of the pH value, relatively high covering ability, and relatively high cathode-current density; and the non-cyanide sulfite system gold electroplating solution is especially suitable for preparation of thick gold layers, and the gold electroplated layeris greater than 200 microns and remains bright.

Description

technical field [0001] The invention specifically relates to a cyanide-free sulfite system electroplating gold solution and an electroplating method. Background technique [0002] Because of its excellent electrical conductivity, thermal conductivity, corrosion resistance, processability, chemical stability, and anti-tarnish performance, the electroplating gold layer is widely used in printed circuit boards, precision instruments, defense technology and fine decoration processing industry. [0003] At present, in the gold electroplating industry, cyanide electroplating technology is the most widely used, and its advantages and disadvantages are very clear. Toxic chemicals pose a huge threat to people and the environment. With the development of society, people pay more and more attention to environmental problems, and it is an urgent need for the electroplating industry to develop a cyanide-free electroplating gold plating solution that is comparable to the cyanide electro...

Claims

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Application Information

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IPC IPC(8): C25D3/48C25D5/18
CPCC25D3/48C25D5/18
Inventor 卢春林张云望张超肖江尹强张帅苏琳李娃
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS