The invention relates to the technical field of surface treatment, in particular to a plating solution and process for
cyanide-free gold
electroplating, and the plating solution for
cyanide-free gold
electroplating comprises
sodium gold
sulfite,
sodium sulfite,
sodium thiosulfate, triammonium citrate,
thiourea and organic amine compounds. The plating solution adopts a
cyanide-free plating
solution system, so that the
environmental protection property is improved. Importantly, an organic amine compound serving as a
welding binding agent is added into the plating solution, amino containing
lone pair electrons is contained in the molecular structure of the organic amine compound and has a strong polarity
adsorption effect, and the amino and active sites on the surface of a
gold plating layer are subjected to a coordination reaction in the subsequent
gold plating process, so that the bonding effect is improved. And monomolecular layer adsorption films which are arranged in order are formed on the surface of the plating layer by means of intermolecular
Van der Waals force, so that non-uniformity of
surface energy is corrected, and unstable
high surface energy is converted into stable, uniform and controllable
surface energy. And meanwhile, the surface is cleaned, impurities are removed, the interface reaction is regulated and controlled, the wettability of the
welding flux on the surface of the plating layer is enhanced, and the
welding flux can be rapidly spread in the
welding process to form a continuous and uniform welding flux layer.