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Coating solution to glass substrate

A glass substrate and coating technology, applied in glass/slag layered products, coatings, chemical instruments and methods, etc., can solve problems such as not easy to become flexible, rigid glass substrate, lack of flexibility, etc.

Active Publication Date: 2021-10-15
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Conventionally, in the fields of electronic devices such as flat panel displays (FPD) such as liquid crystal displays (LCD), plasma display panels (PDP), and organic EL displays (OLED), and electronic paper, electronic devices formed on glass substrates have been mainly used. Mechanism, but the glass substrate is rigid and lacks flexibility, so there is a problem that it is not easy to become flexible

Method used

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  • Coating solution to glass substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0047]

[0048] As PAA solution A-1, prepared U Imide Varnish AR (BPDA / PDA NMP solution). The solution viscosity of the PAA solution at 30 ℃ of 4.3Pa · s, PAA solid content of A-1 with respect to the mass of 19.1 mass%.

[0049]

[0050] Under a nitrogen atmosphere, into PDA (0.600 mol) and a water content of 200ppm or less in NMP (polymerization solvent) was added and stirred glass reactor vessel to the PDA dissolved. After was gradually added BPDA (0.612 mol) while cooling the solution with the cannula to 30 ℃, for 100 minutes the polymerization reaction was 60 ℃, so that a solution viscosity at 25 deg.] C was 75Pa · s and a solid content concentration of the PAA relative B 1-mass to 20% by mass PAA solution.

[0051]

[0052] Under a nitrogen atmosphere, to a PDA into a glass reaction vessel (0.550 mol), ODA (0.050 mol) and a water content of 200ppm or less in NMP (polymerization solvent) and stirred to dissolve PDA and ODA. After the cannula while the following solution w...

Embodiment 2

[0065] The PAA solution (A-3) was obtained in the same manner as in Example 1 relative to the PAA mass of 75 ppm relative to the PAA mass. The A-3 was laminated in the same manner as in Example 1 and evaluated. The evaluation results are shown in Table 1.

Embodiment 3、4

[0067] 3-aminopropyltriethoxysilane (APES, molecular weight: 221.4) were used as an alkoxysilane (A-4 to A-5) to form a coincid amount of the compounding amount (A-4 to A-5). In addition, the laminated body is made in the same manner as in Example 1 and evaluated. The evaluation results are shown in Table 1.

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Abstract

The present invention provides a coating solution that can sufficiently secure adhesion to a glass substrate even if the rate of temperature rise is increased when thermally curing a polyamic acid (PAA) coating film, and that can be easily applied after thermally curing. The form of the polyimide film is peeled from the glass substrate, and the storage stability is good. The present invention relates to a solution for coating on a glass substrate, which is composed of PAA, an amide solvent and an alkoxysilane compound, and is characterized in that: 1) The content of the alkoxysilane compound is more than 5 ppm and less than the mass of PAA 100ppm, 2) The molecular weight of the alkoxysilane compound is 100-300.

Description

Technical field [0001] The present invention relates to a coating solution containing a polyamic acid (PAA) as a polyimide (PI) precursor, which is applied to a glass substrate. Background technique [0002] In the field, electronic components such as electronic devices such as liquid crystal display (LCD), plasma display panel (PDP), organic EL display (OLED), and electronic equipment such as electronic paper are mainly used in the glass substrate. The agency, but the glass substrate is just straight, lack of softness, so there is a problem that it is not easy to become flexible. [0003] Therefore, a method of using a PI film having flexibility and having good heat resistance and dimensional stability is proposed as a flexible substrate. For example, a PAA solution utilizing a prodrug of the PI is proposed to be applied to the PAA solution, which is thermally curing it, thereby forming a state in the glass substrate. Laminate. That is, after the surface of the PI film laminated...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C17/30B32B37/06C08G73/10C08K5/5415C08L79/08C09D7/63C09D179/08B32B17/10
CPCB32B17/10B32B37/06C03C17/30C08G73/10C08K5/5415C08L79/08C09D7/40C09D7/63C09D179/08C08G73/1032
Inventor 杉本洋辅山田祐己吉田猛繁田朗越后良彰
Owner UNITIKA LTD