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Method for processing workpiece

A technology of a workpiece and a processing method, which can be applied to metal processing equipment, machine tools suitable for grinding workpiece planes, and manufacturing tools, etc., and can solve problems such as increased costs.

Active Publication Date: 2020-07-24
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if grinding such as CMP is performed after grinding the workpiece, the bending strength of the workpiece can be improved, but the cost required for processing will increase significantly.

Method used

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  • Method for processing workpiece
  • Method for processing workpiece

Examples

Experimental program
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Effect test

Embodiment Construction

[0018] Embodiments of the present invention will be described with reference to the drawings. figure 1 It is a perspective view which schematically shows the structural example of the grinding apparatus (processing apparatus) 2 used for the processing method of the workpiece of this embodiment. Such as figure 1 As shown, the grinding device 2 has a base 4 for supporting the respective structures. An opening 4a is formed on the front end side of the upper surface of the base 4, and a plate-shaped workpiece 11 (refer to figure 2 (A) etc.) the conveying mechanism 6 for conveying.

[0019] Cassette stands 10 a , 10 b on which cassettes 8 a , 8 b accommodating a plurality of workpieces 11 are placed are provided in front of the opening 4 a. A position adjustment mechanism 12 for adjusting the position of the workpiece 11 is provided obliquely behind the opening 4a. The position adjustment mechanism 12 aligns, for example, the center of the workpiece 11 carried out from the cas...

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PUM

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Abstract

The invention provides a method for processing a workpiece, and the method is good in efficiency. A method of processing a plate-shaped workpiece is provided. The method includes the steps of stickinga protective member to a face side of the workpiece, holding the face side of the workpiece on a holding surface of a chuck table with the protective member interposed therebetween, grinding a reverse side of the workpiece held on the chuck table to thin the workpiece by rotating a grinding wheel including grinding stones that contain abrasive grains, while a grinding fluid is being supplied froma grinding fluid supply nozzle to the reverse side of the workpiece, and after the step of grinding the reverse side of the workpiece, treating the workpiece or the grinding stones by rotating the grinding wheel and bringing the grinding stones into contact with the reverse side of the workpiece, while stopping supplying the grinding fluid from the grinding fluid supply nozzle.

Description

technical field [0001] The present invention relates to a processing method of a workpiece used when processing a plate-shaped workpiece. Background technique [0002] In recent years, in order to realize small-sized and light-weight device chips, chances of thinning plate-shaped workpieces represented by semiconductor wafers by grinding have increased. In this grinding, since the workpiece is processed while being crushed by the grindstone, the to-be-ground surface side of the workpiece tends to remain in a crushed state. [0003] When the ground surface side of the workpiece remains crushed, the bending strength of the workpiece also decreases. Therefore, after grinding the workpiece, the ground surface side of the workpiece is polished by a method such as CMP (Chemical Mechanical Polishing) to eliminate the broken state (for example, refer to Patent Document 1). [0004] Patent Document 1: Japanese Patent Laid-Open No. 2011-101913 [0005] However, if grinding such as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22B24B27/00B24B57/02B24B41/00B24B55/06
CPCB24B7/228B24B27/0076B24B27/0023B24B57/02B24B41/005B24B55/06B24B37/042Y02P70/10H01L21/304B24B37/11B24B37/34B24B7/22
Inventor 广泽俊一郎三谷修三松冈祐哉
Owner DISCO CORP