A production process of high temperature resistant columnar crystals

Abstract

The invention discloses a production process of high-temperature-resistant columnar crystals, which comprises the following steps: cleaning, first using an alkaline cleaning solution to ultrasonically clean the wafer, and then using deionized water to rinse and ultrasonically clean the wafer to remove the surface-adhered Organic matter, metal oxides, particulate pollutants; coating, vacuum coating equipment is used to coat the surface of the chip, and the base alloy layer is formed on the surface of the chip; the outer end of the lead wire and the glass bead is coated with a high-lead-tin layer; dispensing, using TB3301F silver conductive adhesive For bonding the leads to the chip, use DS‑3216 high-temperature resistant UV glue to bond the chip to the glass beads; soldering and curing, adding some solder paste to the automatic plug-in, and then soldering and curing through the reflow oven; the reflow oven includes loading Device, driving device for column crystal transportation, welding furnace, hot air box, cold air box, and feeding device; the invention realizes automatic loading and unloading, sustainable operation, stable temperature in the reflow furnace, uniform heating of column crystals, and high processing quality.

Description

technical field [0001] The invention relates to the technical field of column crystal processing, in particular to a production process of high temperature resistant column crystals. Background technique [0002] Pillar crystal is a commonly used electronic component, which is widely used in oscillating circuits such as computers, remote controls, and mobile communication equipment. With the improvement of industrial automation and the promotion of surface mount components, the traditional process of soldering iron and solder wire has been eliminated, and replaced by a process of soldering and curing through a flow-type reflow oven. It is inconvenient to load and unload materials in the column crystal reflow furnace. During the process of loading and unloading, the hot air in the reflow furnace flows out of the furnace, causing a large temperature change in the furnace and affecting the processing quality of column crystals. Contents of the invention [0003] In order to ...

AI Technical Summary

Problems solved by technology

It is inconvenient to load and unload materials in the column crystal reflow furnace. During the process of loading and unloading, the hot air in the reflow furnace flows out of the furnace, causing a large temperature change in the furnace and affecting the processing quality of column crystals.

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