Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology of PCB board and flame retardant layer, which is applied in the field of PCB board application, can solve the problems that PCB board is easily affected by the surrounding electrical components, the service life of PCB board is low, and the insulation effect of PCB board is poor, so as to improve protection and fire prevention Effect, speed up heat dissipation, prevent water short circuit effect
Active Publication Date: 2021-06-15
万安裕维电子股份有限公司
View PDF9 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0003] At present, as a kind of integrated circuit board, PCB board is developing more and more rapidly. Among them, multi-layer PCB board can increase the wiring area, which has its unique advantages. The previous multi-layer PCB board has a single structure and function, and poor waterproof and flame retardancy. , there is no active heat dissipation device, in some more complex working environments, ordinary PCB boards are difficult to adapt to, resulting in a low service life of the PCB board, and the existing PCB board insulation effect is poor, and the PCB board is easily affected by the surrounding electrical appliances Component influence
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0028] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0030] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "upper", "...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention discloses a flame-retardant PCB board, which comprises a mounting plate, a mounting hole, a silica gel heat conducting frame, a heat dissipation hole, a semiconductor refrigeration sheet, a heat dissipation copper pipe, a connecting copper pipe, a heat conducting plate, an insulating plate, a fixing block, a micro fan, a set Air bucket, fireproof frame, heat conduction inner core, insulating frame, inner insulating layer, flame retardant layer, anti-aging layer, power layer, waterproof layer, grounding layer, chip, copper foil layer, outer insulating layer and temperature sensing IC. The invention has a reasonable structure, the real-time temperature of the chip can be detected in time through the temperature sensing IC, and the work of the micro fan and the semiconductor refrigeration chip is controlled according to the temperature, and the bottom of the PCB board is provided with support insulation and heat transfer through the insulating plate and the heat conducting plate. The micro fan drives the air from the air collecting bucket to the silicone heat conduction frame, so as to quickly cool down the heat dissipation copper pipe and take away the heat generated by the semiconductor refrigeration sheet when it is working. Effect.
Description
technical field [0001] The invention relates to a flame-retardant PCB board, in particular to a flame-retardant PCB board, and belongs to the technical field of PCB board applications. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. According to the number of layers of circuit boards, they can be divided into single-sided, double-sided, four-layer, six-layer and other multi-layer circuit boards. The printed circuit board has developed from a single layer to a double-sided board, a multi-layer board and a flexible board, and is constantly developing in the direction of high precision, high density and high reliability, continuously reducing the volume, reducing the cost, and improving the performance, making the printed circuit board In the development of electronic products in the future, it still maintains a strong vitality. The future development trend of printed ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.