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Manufacturing method of packaging substrate based on radio frequency filter

A technology for radio frequency filters and packaging substrates, which is applied to the improvement of the metal adhesion of insulating substrates, the manufacture of multilayer circuits, and the manufacture of printed circuits. Avoid the infiltration of potion, low production cost and strong function

Active Publication Date: 2020-07-28
JIANGSU PROVISION ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, the most commonly used RF filter substrates at home and abroad are ceramic substrates, but they are expensive and have high research and development costs. For filters with greatly increased demand, ceramic substrates have no obvious price advantage

Method used

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  • Manufacturing method of packaging substrate based on radio frequency filter
  • Manufacturing method of packaging substrate based on radio frequency filter
  • Manufacturing method of packaging substrate based on radio frequency filter

Examples

Experimental program
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Embodiment

[0032] The invention provides a method for manufacturing a package substrate based on a radio frequency filter, comprising the following steps:

[0033] Step 1), prepare a double-sided copper-clad substrate B0, please refer to the attached figure 1 As shown, the double-sided copper-clad substrate B0 is formed by pressing two ultra-thin carrier copper foils 10 and an auxiliary substrate 11 in the middle, wherein each of the ultra-thin carrier copper foils 10 has a layer A carrier copper foil 100 and a layer of ultra-thin copper foil 101 detachably arranged on the carrier copper foil 100, the ultra-thin copper foil can be deposited on the carrier copper foil by electrodeposition processing , but before the electrodeposition operation, the carrier copper foil should be treated accordingly to ensure that the carrier copper foil and the ultra-thin copper foil can be well separated, and the carrier copper foil 100 is still facing the The auxiliary substrate 11; in addition, an alig...

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Abstract

The invention discloses a manufacturing method of a packaging substrate based on a radio frequency filter. The manufacturing method comprises the following steps of preparing a double-sided copper-clad substrate, and an ultrathin carrier copper foil on the double-sided copper-clad substrate being provided with a carrier copper foil and an ultrathin copper foil detachably arranged on the carrier copper foil; laminating a first prepreg and the first copper foil to obtain a first substrate; performing primary targeting and edge milling operation, and then manufacturing a first layer of circuit pattern to obtain a second substrate; laminating a second prepreg and the second copper foil to obtain a third substrate; performing secondary targeting and edge milling operation to obtain a fourth substrate; performing three times of edge milling operation after copper reduction to obtain a fifth substrate; dividing the fifth substrate to obtain a processing plate containing three layers of copperfoils; and carrying out conventional subsequent processing of the processing board to complete manufacturing of the packaging substrate based on the radio frequency filter. The manufacturing method is advantaged in that the manufacturing method is reasonable and easy to operate, and the radio frequency filter packaging substrate manufactured through the manufacturing method is strong in function,good in quality, good in design flexibility, low in manufacturing cost and the like, and can well replace a ceramic substrate.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, and specifically provides a method for manufacturing a radio frequency filter-based packaging substrate. Background technique [0002] At present, the most commonly used RF filter substrates at home and abroad are ceramic substrates, but they are expensive and have high research and development costs. For filters with greatly increased demand, ceramic substrates have no obvious price advantage. Therefore, there is an urgent need for a new product and a new process that can replace the ceramic substrate. [0003] In view of this, the present invention is proposed. Contents of the invention [0004] In order to overcome the above-mentioned defects, the present invention provides a method for manufacturing a package substrate based on a radio frequency filter, which is reasonable in design and easy to operate, and the package substrate of the radio frequency filter produced by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/38H05K3/02
CPCH05K3/4652H05K3/386H05K3/022
Inventor 马洪伟宗芯如杨飞
Owner JIANGSU PROVISION ELECTRONICS CO LTD
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