Manufacturing method of package substrate based on radio frequency filter
A radio frequency filter, packaging substrate technology, applied in the improvement of metal adhesion of insulating substrates, multi-layer circuit manufacturing, printed circuit manufacturing and other directions, can solve the problems of high R&D cost, high price, and no obvious price advantage of ceramic substrates, Achieve the effect of low production cost, easy production, and avoidance of potion infiltration
Active Publication Date: 2022-06-21
JIANGSU PROVISION ELECTRONICS CO LTD
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Problems solved by technology
[0002] At present, the most commonly used RF filter substrates at home and abroad are ceramic substrates, but they are expensive and have high research and development costs. For filters with greatly increased demand, ceramic substrates have no obvious price advantage
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Embodiment
[0032] The invention provides a manufacturing method of a packaging substrate based on a radio frequency filter, comprising the following steps:
[0033] Step 1), prepare a double-sided copper clad substrate B0, please refer to the attached figure 1 As shown, the double-sided copper-clad substrate B0 is formed by pressing two ultra-thin carrier copper foils 10 and an auxiliary substrate 11 in the middle, wherein each of the ultra-thin carrier copper foils 10 has a layer of A carrier copper foil 100 and a layer of ultra-thin copper foil 101 detachably provided on the carrier copper foil 100, the ultra-thin copper foil can be deposited on the carrier copper foil by an electrodeposition process , but before the electrodeposition operation, the carrier copper foil should be treated accordingly to ensure that the carrier copper foil and the ultra-thin copper foil can be well separated, and the carrier copper foil 100 is also facing the The auxiliary substrate 11; in addition, alig...
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Abstract
The invention discloses a manufacturing method of a package substrate based on a radio frequency filter, comprising the following steps: preparing a double-sided copper-clad substrate, on which the ultra-thin carrier copper foil has a carrier copper foil and a detachable carrier copper foil Ultra-thin copper foil on the surface; laminate the first prepreg and the first copper foil to obtain the first substrate; make the first layer of circuit graphics after a target and milling operation to obtain the second substrate; laminate the second prepreg and the first Two copper foils to get the third substrate; second target and edge milling operation to get the fourth substrate; three times of milling operation after copper reduction to get the fifth substrate; divide the fifth substrate to get three layers of copper foil The processed board; the conventional follow-up process is carried out on the processed board to complete the manufacturing of the package substrate based on the radio frequency filter. The manufacturing method is reasonable and easy to operate, and the radio frequency filter packaging substrate prepared by the manufacturing method has the advantages of strong function, good quality, good design flexibility, low manufacturing cost, etc., and can well replace the ceramic substrate.
Description
technical field [0001] The invention relates to the technical field of circuit board fabrication, and in particular provides a fabrication method of a packaging substrate based on a radio frequency filter. Background technique [0002] At present, the most commonly used RF filter substrates at home and abroad are ceramic substrates, but they are expensive and high R&D costs. For filters with greatly increased demand, ceramic substrates have no obvious price advantage. Therefore, there is an urgent need for a new product and a new process that can replace the ceramic substrate. [0003] In view of this, the present invention is proposed. SUMMARY OF THE INVENTION [0004] In order to overcome the above-mentioned defects, the present invention provides a manufacturing method of a packaging substrate based on a radio frequency filter, which has a reasonable design and is easy to operate, and the radio frequency filter packaging substrate prepared by the method has strong func...
Claims
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IPC IPC(8): H05K3/46H05K3/38H05K3/02
CPCH05K3/4652H05K3/386H05K3/022
Inventor 马洪伟宗芯如杨飞
Owner JIANGSU PROVISION ELECTRONICS CO LTD