coc optical fiber automatic coupling packaging equipment and method

Abstract

The invention provides a COC optical fiber automatic coupling packaging device and method, comprising: a base clamping mechanism for clamping the COC base, the COC base is provided with a pigtail installation groove, a laser chip and a lens; the pigtail clamping mechanism is used It is used to clamp the pigtail and couple the pigtail to the COC base. The pigtail is composed of an optical fiber and a fixed block for the pigtail. One end of the optical fiber is placed in the fixed block for the pigtail, and the other end of the optical fiber is connected to an optical power meter; the power-on mechanism It is used to supply power to the laser chip, the monitoring mechanism is used to monitor the relative position of the pigtail and the COC base, and the laser welding mechanism is used to weld the pigtail to the COC base; the steps of the method of the present invention include: clamping device, optical fiber coupling, welding and fixing , to complete the packaging; the invention has reasonable design, high detection accuracy and high equipment utilization rate, reduces the degree of manual participation, avoids the phenomenon of product damage, and effectively reduces production costs.

Description

technical field [0001] The invention relates to the technical field of butterfly semiconductor laser production devices, in particular to a COC optical fiber automatic coupling packaging device and method. Background technique [0002] With the development of COC optical fiber communication and COC optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. The butterfly semiconductor laser is the most commonly used long-distance transmission optical signal amplification device in the COC optical fiber communication industry. An important component, that is, the COC unit, needs to be installed in the butterfly semiconductor laser. [0003] The COC unit is composed of a base and a pigtail. The base part is pre-installed with a laser chip and a l...

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Problems solved by technology

[0005] The invention provides a COC optical fiber automatic coupling packaging device and method, the purpose of which is to solve the existing problems of low production efficiency, low pigtail coupling precision, high packaging cost, and low product qualification rate

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