Photoetching machine motion track planning method and device, computer equipment and storage medium

Abstract

The invention relates to a photoetching machine motion trail planning method and device, computer equipment and a storage medium. The method comprises the steps: acquiring a preset planning value anda constraint condition of a preset motion trail; determining the initial duration of jerk in the preset motion trail according to the preset planning value and a third-order scanning motion trail contour, wherein the third-order scanning stage track contour comprises a jerk motion stage, a uniform acceleration motion stage, a reduced acceleration motion stage and a uniform motion stage; processingthe initial duration according to the constraint condition to obtain a target duration of jerk in the preset motion trail; determining a target function relational expression of jerk and time according to the target duration and the initial function relation of the jerk and the time in the third-order scanning motion track contour; and determining a time-varying curve of the displacement of the preset motion trail by calculating triple integrals of the objective function relational expression. By adopting the method, the motion precision and photoetching precision of the photoetching machinecan be improved.

Description

technical field [0001] The present application relates to the technical field of integrated circuits, in particular to a method, device, computer equipment and storage medium for planning a movement trajectory of a photolithography machine. Background technique [0002] With the increase of integrated circuit processing density and integration, the lithography machine table has higher and higher requirements for motion control accuracy, and the trajectory planning precision of the lithography machine directly determines the accuracy of motion control. During the photolithography process of the stepper lithography machine, the mask plate and the wafer are mounted on the reticle stage and the wafer stage respectively. When exposing, the mask and wafer move to the specified position, and the light source is turned on; after the light passes through the mask, it passes through the lens, which can reduce the circuit pattern to a quarter of its original size, and then project it o...

AI Technical Summary

Problems solved by technology

However, after the lithography machine accelerates to the maximum speed according to the current trajectory, the vibration amplitude is large and the convergence time is long, resulting in low motion accuracy and lithography accuracy of the lithography machine.

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