Electromagnetic shielding structure and manufacturing method thereof

Abstract

The embodiment of the invention provides an electromagnetic shielding structure and a manufacturing method of the electromagnetic shielding structure, and relates to the technical field of semiconductor packaging. The electromagnetic shielding structure comprises a substrate, a chip, a plastic package body and a shielding layer, wherein the chip is mounted on the substrate, and the plastic packagebody is arranged on one side, close to the chip, of the substrate; and a grounding circuit is arranged on the substrate. A grounding groove is formed in the substrate, a conducting layer is arrangedin the grounding groove, and the conducting layer is connected with a grounding circuit of the substrate; and the shielding layer covers the outer surface of the plastic package body and is connectedwith the conductive layer. The grounding groove is formed in the substrate and used for arranging the conducting layer so as to be connected with the shielding layer, and then the electromagnetic shielding function is achieved. Therefore, the short circuit between the conductive layer and the solder balls on the substrate can be avoided, the packaging efficiency is improved, the connection betweenthe conductive layer and the shielding layer is more reliable, and the electromagnetic shielding effect is better.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an electromagnetic shielding structure and a manufacturing method of the electromagnetic shielding structure. Background technique [0002] With the rapid development of the semiconductor industry, a System In a Package (SIP) module structure is widely used in the semiconductor industry. System-in-Package can package and stack chips with different functions. The main advantages are high-density integration, small size of packaged products, superior product performance, and fast signal transmission frequency. As electronic products are used in high-frequency signals in the communication field, electronic products are required to have an electromagnetic shielding structure to prevent electromagnetic interference between various chips and components. [0003] The existing SIP module electromagnetic shielding technology mainly uses a single metal sputtering process, ...

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Problems solved by technology

[0003] The existing SIP module electromagnetic shielding technology mainly uses a single metal sputtering process, which requires metal sputtering after a single product substrate is planted with a film on the back of the ball. Due to the height of the solder ball, the sealing of the substrate back film is not good. During the metal sputtering process, the metal easily enters the ball-planting surface of the substrate, causing a short circuit between the solder ball and the metal layer, resulting in a loss of product yield

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