Semiconductor processing equipment and process control method thereof

A technology for processing equipment and process control, applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve the problems of inability to meet temperature changes, temperature adjustment, etc., to improve the scope of application, improve accuracy, and improve process efficiency Effect

Pending Publication Date: 2020-08-04
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the shortcomings of the existing methods, this application proposes a semiconductor processing equipment and its process control method to solve the problem that the glue rem

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  • Semiconductor processing equipment and process control method thereof
  • Semiconductor processing equipment and process control method thereof
  • Semiconductor processing equipment and process control method thereof

Examples

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Example Embodiment

[0024] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0025] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides semiconductor processing equipment and a process control method thereof. The semiconductor processing equipment comprises a cavity, a lifting assembly, a baseand a temperature measuring assembly, wherein the base and the temperature measuring assembly are arranged in the cavity; the lifting assembly is used for bearing and driving wafers to be selectivelylocated at multiple stations above the base, the multiple stations correspond to the multiple target temperature values in a one-to-one mode, and the distance between each station and an upper surfaceof the base is inversely proportional to the corresponding target temperature value; and the temperature measuring assembly is arranged at positions where the lifting assembly is in contact with thewafers and is used for acquiring actual measurement temperature values of the wafers in real time. According to the embodiment of the invention, the purpose of adjusting the target temperature value according to different types of wafers and different processes is achieved, and the requirement for temperature change in the process can be met such that the yield of the wafers is effectively improved, and the process efficiency is greatly improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor processing equipment and a process control method thereof. Background technique [0002] Currently, metal etching equipment is an indispensable equipment in the manufacturing process of integrated circuits (ICs). A general metal ion plasma etching equipment includes: a loading and unloading module, a transfer module, a calibration module, two reaction chambers, two degumming chambers and a cooling (Cooling) chamber. The transfer module is connected to the reaction chamber module, and is responsible for transferring the wafer to be processed to the reaction chamber, and performs the etching process in the reaction chamber. After the process is completed, the wafer is transferred to the deglue chamber through the transfer module. The deglue chamber performs the deglue process. After the process is comp...

Claims

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Application Information

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IPC IPC(8): H01J37/20H01J37/244H01J37/305H01L21/67H01L21/687
CPCH01J37/3053H01J37/20H01J37/244H01L21/68742H01L21/67248H01L21/67253H01L21/67069
Inventor 杨雄
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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