Wafer repasting device

Abstract

The invention discloses a wafer repasting device. The wafer repasting device comprises a first repasting table disc, a roller arranged over the first repasting table disc in a sliding mode, a blue film cutting assembly arranged over the first repasting table disc, and a carrying unit used for carrying a wafer on the first repasting table disc to a second repasting table disc and pressing the waferdownwards to enable a blue film to be firmly pasted to the wafer. The blue film cutting assembly can be switched between the position close to the first repasting table disc and the position far awayfrom the first repasting table disc and is used for cutting the blue film along the outline of a primary-secondary ring. The wafer repasting device provided by the invention is simple in structure, convenient to operate, stable in equipment operation, simple to maintain and low in cost; during work, repasting of the wafer can be completed only through manual feeding and discharging, pure manual operation is replaced, the risk of manual operation is reduced to a great extent, and therefore the repasting quality of the wafer is guaranteed, and the production efficiency is greatly improved.

Description

technical field [0001] The invention generally relates to the technical field of semiconductors, and in particular to a wafer transfer device. Background technique [0002] The gallium arsenide wafer operation needs to transfer the gallium arsenide wafer to the designated blue film for the wafer loading process. At present, the incoming materials of the gallium arsenide wafer are fixed and protected by the mother ring, and the product has been ground, cut and pasted on the On the dicing film, you only need to transfer the product on the designated blue film for the film loading process. Since there is no such transfer equipment in the industry, the current mass-produced products are manually transferred, and the risk of action is high and often occurs. Accidents such as wafer dropping, chip scratching, loss, and collapse directly cause product loss. Contents of the invention [0003] In view of the above defects or deficiencies in the prior art, it is desired to provide a...

AI Technical Summary

Problems solved by technology

[0002] The gallium arsenide wafer operation needs to transfer the gallium arsenide wafer to the designated blue film for the wafer loading process. At present, the incoming materials of the gallium arsenide wafer are fixed and protected by the mother ring, and the product has been ground, cut and pasted on the On the dicing film, you only need to transfer the product on the designated blue film for the film loading process. Since there is no such transfer equipment in the industry, the current mass-produced products are manually transferred, and the risk of action is high and often occurs. Accidents such as wafer dropping, chip scratching, loss, and collapse directly cause product loss

Images