Preparation method of 77GHz millimeter wave radar circuit board
A millimeter-wave radar and circuit board technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of poor production quality of 77GHz millimeter-wave radar circuit boards, improve signal transmission performance, reduce copper reduction Difficulty, reducing the effect of plugging holes
Inactive Publication Date: 2020-08-04
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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[0005] In order to solve the above-mentioned technical problem of poor production quality of the 77GHz millimeter wave radar circuit board, the present invention provides a method for preparing a 77GHz millimeter wave radar circuit board with high production quality
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[0024] The method for preparing a 77GHz millimeter-wave radar circuit board of the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings.
[0025] Please refer to figure 1 As shown, it is a schematic structural diagram of a 77GHz millimeter-wave radar circuit board in the present invention.
[0026] The invention provides a method for preparing a 77GHz millimeter-wave radar circuit board, comprising the following steps:
[0027] Step S1, making L1-L2 laminates, L3-L4 laminates and L5-L6 laminates respectively.
[0028] Among them, the three-layer board is made by the processing steps of cutting, baking plate, inner layer wet film, inner layer etching and inner layer AOI to ensure the uniformity of the three-layer board manufacturing process, thereby improving the stability of the production quality of the circuit board. In specific applications, the L1-L2 layer board only makes the L2 layer circuit, the...
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The invention relates to a preparation method of a 77GHz millimeter wave radar circuit board. The preparation method comprises the following steps: respectively manufacturing an L1-L2 laminate, an L3-L4 laminate and an L5-L6 laminate; pressing the three laminates in sequence to obtain a composite board; sequentially carrying out edge milling, primary copper reduction browning, primary outer layerdry film, acid etching, laser blind hole, secondary outer layer dry film and pattern electroplating on the composite board, and carrying out post-process manufacturing according to a conventional circuit board processing flow; the laser blind hole step sequentially comprises the following processing procedures of: drilling for the first time, copper deposition plate electroplating for the first time, reducing copper and browning for the second time, plugging holes with resin, drilling for the second time, copper deposition plate electroplating for the second time and the like. According to themethod, the laser blind hole processing step including first drilling, first copper deposition plate electroplating, second copper reduction browning, resin hole plugging, second drilling and secondcopper deposition plate electroplating are adopted, the windowing laser mode is adopted, the copper reduction difficulty is reduced, the copper reduction precision is improved, the quality is improved, and bad products are reduced.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for preparing a 77GHz millimeter-wave radar circuit board. Background technique [0002] Millimeter-wave radar detects targets by transmitting and receiving high-frequency electromagnetic waves, and the back-end signal processing module uses echo signals to calculate target information such as the existence, speed, direction, distance, and angle of moving objects. Millimeter wave radar has the characteristics of small size, light weight, high degree of integration, and sensitive sensing. Its unique ability to penetrate fog, smoke, and dust can be applied all-weather and all-weather, meeting the requirements of unmanned aerial vehicles (UAV), Helicopters, small airships, automotive active safety, speedometers, liquid level gauges, street lighting systems, intrusion alarm systems, automatic door sensors and other application requirements. [0003] As the advantages...
Claims
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IPC IPC(8): H05K3/46H05K3/42H05K3/00
CPCH05K3/0047H05K3/424H05K3/4644
Inventor 周刚程剑王欣
Owner GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD