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Circuit board material layer pre-laminating device and process

A technology of material layers and circuit boards, applied in printed circuit, thin material processing, printed circuit manufacturing, etc., can solve the problems of low production efficiency, high labor intensity, high error rate, etc., to improve product quality, save labor costs, The effect of strong automation performance

Pending Publication Date: 2020-08-07
ACCUTECH SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, circuit boards generally include multi-layer structures such as PP sheets and core boards that are stacked. During the production process of circuit boards, it is necessary to pre-laminate the multi-layer structures such as PP sheets and core boards, and then press them together. Processing, in which the process of pre-lamination is generally done manually. In this process, it is necessary to manually place the materials of each layer according to the order of the layers. This not only results in low production efficiency, labor costs, and high labor intensity, but also once the order of the layers is placed incorrectly. There will be scrap boards, high error rate, difficulty in quality control, and low yield

Method used

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  • Circuit board material layer pre-laminating device and process
  • Circuit board material layer pre-laminating device and process
  • Circuit board material layer pre-laminating device and process

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Experimental program
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Effect test

Embodiment 1

[0025] This embodiment proposes a kind of circuit board material layer pre-lamination equipment, combined with Figure 1 to Figure 11 As shown, it includes a frame 1, and the frame 1 is provided with a PP sheet feeding mechanism 2, a pre-stacking table 3, a transfer table 4, a core board feeding mechanism 5, and a paper-separated feeding mechanism from left to right. 6. The frame 1 is also provided with a sliding carrier 7 arranged left and right, and the sliding carrier 7 is provided with a PP retrieving manipulator 8, a core plate transfer manipulator 9, and a core plate in sequence from left to right. The material manipulator 10 and the paper-separated feeding manipulator 11, the PP retrieving manipulator 8 is used to pick up the PP sheet 100 from the PP sheet feeding mechanism 2 and place it on the pre-stacking platform 3, and the core board feeding manipulator 10 is used to pick up a core board from the core board feeding mechanism 5 and place it on the transfer table 4, ...

Embodiment 2

[0042] At present, for the raw materials of PP sheets placed in multiple layers, the commonly used method of retrieving materials is manual retrieving with the help of tools. This method of retrieving materials has low work efficiency and high labor costs, and cannot be used in the automatic equipment for pre-lamination of circuit board material layers. Promote apps.

[0043] In this regard, this embodiment proposes a PP sheet retrieving device that can improve work efficiency, reduce labor costs, and have more automatic performance. Figure 1 to Figure 4 As shown, it includes a frame 1, the frame 1 is provided with a PP sheet feeding mechanism 2, a pre-stacking platform 3 and a sliding carrier 7, and a PP sheet 100 is placed on the PP sheet feeding mechanism 2, so A PP retrieving manipulator 8 is provided on the sliding carrier frame 7, and the PP reclaiming manipulator 8 includes a retrieving slide 80 and a retrieving translational drive mechanism 81 for driving the reclaimi...

Embodiment 3

[0065] At present, during the stacking process of multiple PP sheets, due to the influence of static electricity and other factors, two or more PP sheets are usually removed at the same time when taking materials. Once the number of PP sheets taken out is wrong, it will be directly Leading to the scrapping of circuit boards, the error rate and error rate are high, and it is difficult to meet the production requirements.

[0066] In this regard, this embodiment proposes a PP sheet feeding mechanism that can avoid taking multiple PP sheets by mistake due to electrostatic adsorption, thereby improving the accuracy of the feeding action and helping to improve the yield of circuit boards. Please refer to figure 1 and figure 2 , the PP sheet feeding mechanism 2 includes a square PP sheet feeding table 20, four stoppers 21 are fixed on the PP sheet feeding table 20, and the four stoppers 21 are respectively close to the four sides of the PP sheet feeding table 20. At the two edges,...

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Abstract

The invention discloses a circuit board material layer pre-laminating device which comprises a machine frame. A PP sheet feeding mechanism, a pre-laminating table, a transferring table, a core board feeding mechanism and a partition paper discharging mechanism are sequentially arranged on the machine frame from left to right. A slide bearing frame is arranged on the machine frame in a left-right mode. A PP sheet picking mechanical hand, a core board transferring mechanical hand, a core board feeding mechanical hand and a partition paper discharging mechanical hand are sequentially arranged onthe slide bearing frame from left to right. The PP sheet picking mechanical hand is used for picking a PP sheet from the PP sheet feeding mechanism and putting the PP sheet onto the pre-laminating table. The core board feeding mechanical hand is used for picking a core board from the core board feeding mechanism and putting the core board onto the transferring table. The partition paper discharging mechanical hand is used for picking partition paper between two core boards from the core board feeding mechanism and putting the partition paper onto the partition paper discharging mechanism. Thecore board transferring mechanical hand is used for picking a core board from the transferring table and putting the core board onto the pre-laminating table. By means of the circuit board material layer pre-laminating device, labor can be saved, production efficiency can be improved, the error rate is reduced, and the product quality is improved.

Description

technical field [0001] The invention relates to circuit board production equipment, in particular to a circuit board material layer pre-lamination equipment and process. Background technique [0002] The circuit board, also known as the PCB board, is an indispensable equipment in current electronic and electrical equipment, and it is also an important material to materialize the circuit principle. In the prior art, circuit boards generally include multi-layer structures such as PP sheets and core boards that are stacked. During the production process of circuit boards, it is necessary to pre-laminate the multi-layer structures such as PP sheets and core boards, and then press them together. Processing, in which the process of pre-lamination is generally done manually. In this process, it is necessary to manually place the materials of each layer according to the order of the layers. This not only results in low production efficiency, labor costs, and high labor intensity, bu...

Claims

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Application Information

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IPC IPC(8): B65G47/91B65G59/00B65G61/00B65G59/04B65H5/10H05F3/00H05K3/46
CPCB65G47/912B65G59/005B65G61/00B65G59/04B65H5/10H05F3/00H05K3/4638B65G2201/022
Inventor 杨海涛解建年张付贵辛林峰
Owner ACCUTECH SHENZHEN CO LTD
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