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Ceramic chopper, manufacturing method thereof and semiconductor packaging method

A production method and a riving knife technology are applied in the field of ceramic materials, which can solve the problems of poor morphology and quality, and achieve the effects of improving service life, improving service life and welding wire quality, and avoiding dimensional changes.

Inactive Publication Date: 2020-08-18
SHENZHEN SUNTECH ADVANCED CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the morphology and quality of the laser-treated capillary wires are worse than those of the traditional heat-treated capillary wires

Method used

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  • Ceramic chopper, manufacturing method thereof and semiconductor packaging method
  • Ceramic chopper, manufacturing method thereof and semiconductor packaging method
  • Ceramic chopper, manufacturing method thereof and semiconductor packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The manufacture process of the ceramic riving knife of the present embodiment is specifically as follows:

[0047] Put the semi-finished product of alumina ceramic rivet in the laser equipment, set the laser wavelength of the laser device to 341nm, the frequency to 200Hz, and the energy conversion power to 30%, to carry out laser treatment on the semi-finished product of alumina ceramic rivet, and use the shooting positioning device to The surface topography of the semi-finished ceramic riving knife is positioned and identified, and evenly spaced grooves and protrusions are formed on the surface area of ​​the semi-finished alumina ceramic riving knife except for chamfering. The distance between the grooves and the protrusions was 2 μm, and the ceramic capillary of this example was obtained.

Embodiment 2

[0049] The manufacture process of the ceramic riving knife of the present embodiment is specifically as follows:

[0050] Put the semi-finished alumina ceramic rivet in the laser equipment, set the laser wavelength of the laser equipment to 700nm, the frequency to 300Hz, and the energy conversion power to 40%, and carry out laser treatment on the semi-finished alumina ceramic rivet, and use the shooting positioning device to The surface topography of the semi-finished ceramic riving knife is identified, and grooves and protrusions are evenly spaced on the surface area of ​​the semi-finished alumina ceramic riving knife except for chamfering. The distance between adjacent grooves is 8 μm, and the distance between adjacent grooves The distance from the protrusion is 3 μm, and the ceramic capillary of this embodiment is obtained.

Embodiment 3

[0052] The ceramic rivet manufacturing process of the present embodiment is specifically as follows:

[0053] Put the semi-finished alumina ceramic rivet in the laser equipment, set the laser wavelength of the laser equipment to 500nm, the frequency to 400Hz, and the energy conversion power to 25%, carry out laser treatment on the semi-finished alumina ceramic rivet, and use the shooting positioning device to The surface topography of the semi-finished ceramic riving knife is identified, and grooves and protrusions are evenly spaced and arranged on the surface area of ​​the semi-finished alumina ceramic riving knife except for chamfering. The distance between adjacent grooves is 7 μm, and the distance between adjacent grooves and the distance between the protrusions is 1 μm, and the ceramic capillary of this embodiment is obtained.

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Abstract

The invention relates to a ceramic chopper, a manufacturing method thereof and a semiconductor packaging method. The manufacturing method of the ceramic chopper includes the following steps of providing a semi-finished product of the ceramic chopper, wherein the semi-finished product of the ceramic chopper has a chamfer; and performing laser treatment on an area outside the chamfer of the semi-finished product of the ceramic chopper so that a plurality of grooves and protrusions arrayed at intervals can be formed on the surface of the semi-finished product of the ceramic chopper to obtain theceramic chopper, wherein the distance between the adjacent grooves and protrusions is 1-3 [mu]m, and the distance between the adjacent grooves is 3-12 [mu]m. By means of the manufacturing method of the ceramic chopper, the service life of a bonding wire can be prolonged, and the quality of the bonding wire can be improved.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to a ceramic chopper, a manufacturing method thereof, and a semiconductor packaging method. Background technique [0002] The ceramic rivet is an axisymmetric ceramic tool with a vertical hole. Because of its advantages of high hardness, high wear resistance, high temperature resistance, chemical corrosion resistance, high surface finish and high dimensional accuracy, it is widely used in the field of semiconductor wire bonding welding. play an irreplaceable role. Wire bonding is the process of pasting the chip electrode face up on the package base, and connecting the chip electrode and the corresponding electrode on the lead frame with a wire by welding. The purpose of wire bonding is to electrically conduct the chip with the external packaging frame to ensure the smooth transmission of electrical signals. The choice of metal wire will affect the welding quality, device reliabili...

Claims

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Application Information

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IPC IPC(8): B28D5/00B23K26/00H01L21/60
CPCB23K26/00B28D5/00B23K2103/52H01L24/78H01L24/85
Inventor 朱佐祥谭毅成
Owner SHENZHEN SUNTECH ADVANCED CERAMICS