Polyimide laminated layer and preparation method thereof and copper-clad plate containing polyimide laminated layer

Abstract

The invention provides a polyimide laminated layer and a preparation method thereof, and a copper-clad plate containing the polyimide laminated layer. The polyimide laminated layer comprises a first polyimide layer and a second polyimide layer which are sequentially laminated on a base material layer, and the first polyimide layer has flexible functional groups. In terms of monomers providing theflexible functional groups, the mass content of the flexible functional groups of the first polyimide layer is 2.5-6.5%, the CTE of the first polyimide layer is 16-30 ppm / DEG C, the CTE of the secondpolyimide layer is 12-20 ppm / DEG C, the CTE of the first polyimide layer is greater than the CTE of the second polyimide layer, and the CTE of the second polyimide layer is greater than the CTE of thebase material layer. Because the first polyimide layer contains a certain amount of the flexible functional groups, the copper-clad plate can maintain the flexibility of the polyimide layer; polyimide layers with different performances are combined for use, so the high-frequency / high-speed transmission performance of the copper-clad plate is ensured, and 5G electron transmission requirements aremet.

Description

technical field [0001] The invention relates to the technical field of polyimide copper-clad laminates, in particular to a polyimide laminate, a preparation method thereof and a copper-clad laminate comprising the same. Background technique [0002] With the development of integrated circuits (ICs) in the electronics industry towards miniaturization, high density, and portability, printed circuit board (PCB) wiring is finer, the line width is smaller, and the dimensional stability is higher. At the same time, since the world will develop high-frequency / high-speed 5G communication technology in an all-round way in 2020, it is also required that the dielectric layers of related equipment and PCBs and ICs used have lower dielectric constant and loss to reduce the impact on signal transmission. Negative effects such as RC delay, crosstalk and power loss. [0003] At present, polyimide (PI) copper-clad substrates have been widely used in PCBs and flexible printed circuits (FPCs)...

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Problems solved by technology

[0006] The main purpose of the present invention is to provide a polyimide laminate, its preparation method and a copper-clad laminate containing it, so as to solve the problem that the flexible copper-clad laminate in the prior art cannot meet the requirements of 5G wireless high-frequency / high-speed transmission

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