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High-performance heat-conducting silicone grease and preparation method thereof

A heat-conducting silicone grease and high-performance technology, which is applied in the field of high-performance thermal-conducting silicone grease and its preparation, can solve problems such as difficulty in dispersion, affecting thermal conductivity, and complexity, and achieve the effects of reducing interface thermal resistance, simplifying the preparation process, and reducing defects

Inactive Publication Date: 2020-08-28
大连理工大学重大装备设计与制造郑州研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the existence of van der Waals force, nano-graphene is easy to agglomerate, and has poor compatibility with base oil, and is not easy to disperse, which affects the improvement of thermal conductivity.
In the prior art, the preparation process of graphene thermal grease is extremely complicated and costly. How to improve the synergistic thermal conductivity of graphene, simplify the process and reduce the cost is worthy of our research.

Method used

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  • High-performance heat-conducting silicone grease and preparation method thereof
  • High-performance heat-conducting silicone grease and preparation method thereof
  • High-performance heat-conducting silicone grease and preparation method thereof

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Embodiment 1、2、3、6

[0019] The preparation steps of embodiment 1, 2, 3, 6 thermal conductive silicone grease are as follows:

[0020] (1) Mix the modifier and the base heat transfer oil in proportion, heat and stir at 90°C for 0.5h to obtain mixture 1;

[0021] (2) Add the alumina powder to the mixture 1 after grading according to the ratio in Table 1, and then stir for 0.5h to obtain the premix;

[0022] (3) Grind the premix in a three-roll machine for 1-2 hours, and then vacuumize to obtain a homogeneous heat-conducting silicone grease.

[0023] The preparation steps of embodiment 4,5,7,8 thermal conductive silicone grease are as follows:

[0024] (1) The modifying agent with 5% powder mass is prepared into a solution with a concentration of 0.1% with ethanol solution, and then thermally conductive fillers C7 and C8 graphene are added to the solution, heated and stirred at 50° C. for 1 hour to obtain a mixed solution, and then put Go into oven and dry, obtain the graphene after modification; ...

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Abstract

The invention belongs to the technical field of thermal interface organic heat conduction materials. The invention relates to the technical field of silicone grease, in particular to high-performanceheat-conducting silicone grease and a preparation method thereof, the heat-conducting silicone grease is specifically composed of 8%-20% of matrix heat-conducting oil, 75%-91% of heat-conducting filler and 0.05%-5% of a modifier, wherein the heat-conducting filler is mainly graphene and aluminum oxide. According to the preparation method, modification of graphene is realized by adding graphene into an ethanol solution of a modifier and carrying out heating and stirring; the modification of aluminum oxide is completed by directly adding a modifier into matrix heat-conducting oil, uniformly heating and stirring the mixture for uniform dispersion, wherein the oleophylic group of the modifier is combined with the matrix oil; then adding the modifier into the matrix oil, adding the alumina powder, and heating and stirring the mixture to connect the hydrophilic group of the modifier to the surface of the powder, thereby implementing favorable dispersion of the powder particles in the matrixoil, enhancing the combination between the matrix oil and the particles, reducing the defects of the bonding interface and lowering the interface thermal resistance between the heat-conducting fillerparticles and the matrix.

Description

technical field [0001] The invention belongs to the technical field of thermal interface organic heat-conducting materials, and in particular relates to a high-performance heat-conducting silicone grease and a preparation method thereof. Background technique [0002] In recent years, electronic products tend to be more and more miniaturized and refined, resulting in a sharp increase in the heat generated by electronic components per unit area. An increase in temperature of electronic components will lead to performance degradation, so the electronic components must be cooled, generally by installing cooling components (radiators, etc.) near heat-generating components. Due to the limitation of machining accuracy, there are many gaps between the contact surfaces of the cooling component and the heat generating component, and the air filling these gaps has a large thermal resistance, which will greatly reduce the heat dissipation effect. The thermal conductive silicone grease ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/08
CPCC09K5/08
Inventor 阮诗伦段素萍黄静静孙秀洁李书珍于坦张留新
Owner 大连理工大学重大装备设计与制造郑州研究院
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