All-optical online monitoring device for laser scribing
A laser scribing and monitoring device technology, which is applied in laser welding equipment, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve the problems of unrealized internal modification point and modification layer transient recording and analysis of the wafer , to achieve the effect of controlling time and material costs
Pending Publication Date: 2020-09-01
郝强 +1
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Problems solved by technology
At present, there is still a lack of in-situ real-time monitoring methods for laser scribing superhard wafers, and the transient recording and analysis of the modification points and the formation process of the modification layer inside the wafer have not been realized.
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[0030] Hereinafter, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0031] The laser scribing online monitoring device of this embodiment is composed of figure 1 The dual-wavelength ultrashort pulse laser light source shown, such as figure 2 The dual-wavelength pump-probe wafer dicing device shown is composed.
[0032] The dual-wavelength ultrashort pulse laser light source includes an ultrashort pulse seed source 1, a beam splitter 2, a highly nonlinear fiber pulse amplifier...
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The invention provides an all-optical online monitoring device for laser scribing. The all-optical online monitoring device is used for conducting onsite real-time observation on the whole dynamic process of laser scribing and comprises a frequency doubling crystal, a half-reflecting mirror, a dichroic mirror, a dichroic objective lens, a first detector and a second detector; the frequency doubling crystal conducts frequency doubling on detection light, and then the detection light is reflected to a to-be-monitored wafer through the half-reflecting mirror; the dichroic mirror is located on a light path between the half-reflecting mirror and the to-be-monitored wafer and used for reflecting pumping light / scribing light to be combined with the detection light to form a beam; the dichroic objective lens is located on a light path between the dichroic mirror and the to-be-monitored wafer and used for focusing the pumping light / the scribing light with the detection light, and a focus is located in the to-be-monitored wafer; the first detector is located on a transmission light path of the half-reflecting mirror in one side of the to-be-monitored wafer, is farther away from the to-be-monitored wafer than the half-reflecting mirror, and is used for recording reflecting information of the detection light; and the second detector is located on the other side of the to-be-monitored wafer, arranged on the light path extension line from the dichroic objective lens to the to-be-monitored wafer and used for recording transmission information of the detection light.
Description
Technical field [0001] The invention relates to the monitoring of laser scribing, in particular to an on-line monitoring device for laser scribing in an all-optical manner. Background technique [0002] In semiconductor manufacturing, wafers are the upstream core of the semiconductor industry chain, and materials and equipment are the cornerstones of the entire semiconductor industry. Larger wafers, smaller dies (chips), and more functions are the future development trends of the semiconductor industry. The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Among them, wafer dicing is an important link in the semiconductor chip packaging process. It is a process of dividing a whole wafer into individual dies along a preset cutting path. This link has a direct and direct impact on the quality and life of the chip. important influence. The quality standard of wafer scribing consists of multiple harsh conditions such as ch...
Claims
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IPC IPC(8): B23K26/70B23K26/03B23K26/55H01L21/66H01L21/67B23K101/40
CPCB23K26/702B23K26/55B23K26/03H01L21/67253H01L22/20B23K2101/40
Inventor 郝强曾和平
Owner 郝强