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Printed circuit board and electronic product using same

A technology for printed circuit boards and conductive layers, applied in the direction of printed circuit stress/deformation reduction, printed circuit components, circuit devices, etc., to achieve the effect of improving heat dissipation

Inactive Publication Date: 2020-09-04
GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a printed circuit board equipped with these electronic components, its heat dissipation performance and size requirements are also getting higher and higher. In the case of complex circuit design and application, the requirements for its heat dissipation performance are getting higher and higher, and the existing printed circuit boards are difficult to meet the above requirements

Method used

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  • Printed circuit board and electronic product using same
  • Printed circuit board and electronic product using same
  • Printed circuit board and electronic product using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Such as Figures 1 to 3 As shown, this embodiment provides a printed circuit board with a multi-layer laminated structure, including a base material layer 110 and several conductive layers 120 and heat dissipation insulating layers 1312130 arranged on both sides of the base material layer 110. The conductive layer 120 is a copper foil layer, and the heat dissipation insulating layer 1312130 is made of epoxy resin material in which heat dissipation insulating balls 131 are encapsulated.

[0039] In this solution, epoxy resin is used for insulation. By discretely setting heat dissipation insulating balls 131 in the epoxy resin, the heat dissipation effect of the heat dissipation insulation layer 1312130 is enhanced while ensuring the insulation effect, and the heat dissipation effect of the overall product can be improved.

[0040] Specifically, in this embodiment, a four-layer copper foil structure is adopted, that is, a first copper foil layer and a second copper foil l...

Embodiment 2

[0059] Such as Figures 4 to 6 As shown, this embodiment provides a printed circuit board with a multi-layer laminated structure, including a base material layer 210, and several conductive layers 220 and heat dissipation insulating layers 2312230 disposed on both sides of the base material layer 210, The conductive layer 220 is made of graphene material, and the heat dissipation insulating layer 2312230 is made of epoxy resin material with heat dissipation insulating balls 231 encapsulated inside.

[0060] The structure of the printed circuit board in this embodiment is basically the same as that in Embodiment 1. The main difference is that the conductive layer 220 in this solution is made of graphene material, and the use of graphene as the conductive layer 220 can have a better heat dissipation effect , compared with the copper foil layer used as the conductive layer 220, the graphene material can reduce the thickness of the conductive layer 220, thereby reducing the total ...

Embodiment 3

[0078] Such as Figures 7 to 9 As shown, this embodiment provides a printed circuit board with a multi-layer laminated structure, including a base material layer 310 and several conductive layers 320 and heat dissipation insulating layers 3312330 disposed on both sides of the base material layer 310. The conductive layer 320 is made of graphene material, the heat dissipation insulating layer 3312330 is made of epoxy resin material with heat dissipation insulating balls 331 encapsulated inside, and at least one side of the substrate layer 310 is provided with a polyimide film 350 .

[0079] The solution described in this embodiment is basically the same as that described in Embodiment 2, the main difference being that in this embodiment a polyimide film 350 is provided on at least one surface of the substrate layer 310 .

[0080] By arranging the polyimide film 350, the toughness of the printed circuit board can be increased, making it less likely to be damaged such as tearing...

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PUM

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Abstract

The invention provides a printed circuit board and an electronic product using the same. The printed circuit board of a multilayer laminated structure comprises a base material layer, a plurality of conducting layers and heat dissipation insulating layers, the conducting layers and the heat dissipation insulating layers are arranged at two sides of the base material layer, the conducting layers are made of graphene materials, the heat dissipation insulating layers are made of epoxy resin materials, heat dissipation insulating balls are packaged inside the epoxy resin materials, and at least one side of the base material layer is provided with polyimide films. By arranging the polyimide films, the strength and toughness of the printed circuit board can be improved, and the printed circuit board is not prone to tearing and other damage phenomena.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a printed circuit board and electronic products using the same. Background technique [0002] In recent years, high-density integration and high-density mounting of electronic components included in the above-mentioned electronic equipment have progressed in response to demands for higher functionality of electronic equipment. As a printed circuit board equipped with these electronic components, its heat dissipation performance and size requirements are getting higher and higher. In the case of complex circuit design and application, the requirements for its heat dissipation performance are getting higher and higher, and the existing printed circuit boards are difficult to meet the above requirements. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide a printed circuit board, which can solve the above-mentioned probl...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/09
CPCH05K1/0207H05K1/0256H05K1/0271H05K1/0298H05K1/09
Inventor 王琇如
Owner GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD