DFN packaged digital infrared temperature sensor

An infrared temperature and sensor technology, applied in the direction of instruments, measuring devices, scientific instruments, etc., can solve the problems of unfavorable product promotion and application, large volume of TO packaging, high heat insulation requirements, etc., and achieve good electromagnetic shielding function, large thermal resistance, The effect of reducing the rate of heat loss

Inactive Publication Date: 2020-09-08
NANJING UNIV OF INFORMATION SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the common packaging method of infrared temperature sensors on the market is TO can packaging, and the high-precision infrared thermopile is packaged in a metal TO can, but the TO package is large in size and not easy to integrate.
[0005] DFN plastic packaging method is currently mostly used in the packaging process of traditional IC integrated circuits, which has the advantages of small size and mass production; however, DFN plastic packaging method is rarely used in thermopile infrared temperature sensors at present.
There are mainly the following technical difficulties: (1) The infrared radiation energy received by the thermopile is less, and the heat insulation requirements for heat are high; (2) DFN plastic packaging, the electromagnetic shielding effect is weak
In addition, although some domestic companies have successfully developed micro-packaged infrared thermopile sensors, their output signals are still analog voltage signals, which is not conducive to the promotion and application of this product.

Method used

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  • DFN packaged digital infrared temperature sensor
  • DFN packaged digital infrared temperature sensor
  • DFN packaged digital infrared temperature sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The digital infrared temperature sensor of DFN package of the present invention comprises: DFN package housing 1; Infrared filter 2; Air induction hole 3; Exhaust hole 4; TC module 5; .

[0033] see figure 1 and figure 2 , in order to reduce the volume of the digital infrared temperature sensor of the DFN package as much as possible, a micro thermopile is selected as the temperature sensitive device, and it is packaged inside the sensor, and its function is to convert the infrared radiation energy into an electrical signal; the infrared filter The wavelength passband of sheet 2 is 2-14 μm, which realizes the filtering of interfering light; the TC module 5 can adopt a metal thermal resistor, a PTC thermistor or an NTC thermistor to monitor the temperature of the cold end of the thermopile. Compensation to obtain the real-time temperature of the target to be measured; the ASIC module can supply power to the NTC thermistor, and can process the analog signals of the ther...

Embodiment 2

[0036] see figure 2 , the further design of this example is that the package is a plastic DFN package, and five pins are installed on the bottom of the package, which are SDA, VDD, GND, SCL, and ADDR. The function of the SDA is the I2C data line; VDD is the power supply terminal; GND is the ground terminal; SCL is the I2C clock line; ADDR is the LSB port of the I2C.

Embodiment 3

[0038] see image 3 The further design of this example lies in that, by coating the inner wall of the package with a shielding layer and a heat insulating layer, the electromagnetic shielding effectiveness of the infrared temperature sensor is improved, the short circuit of the connecting wire is prevented, the heat loss rate is reduced, and the detection accuracy is improved. On the inner wall of the DFN package shell 301, the shielding layer is Cu / Ni plating layer 303 and Cu / Ni plating layer 303 and SiO 2 The thin film 302, wherein the thickness of the copper plating layer is 0.5-3.8 μm, and the thickness of the nickel plating layer is 0.2-0.5 μm. The insulation layer is made of SiO 2 Thin film 302, SiO 2 The film thickness is 500 nm or 1 μm.

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Abstract

The invention discloses a DFN packaged digital infrared temperature sensor. The sensor comprises a DFN packaging shell with a window in the top, a thermopile, a TC template and an ASIC module are arranged in the DFN packaging shell, an infrared optical filter is arranged at the window of the DFN packaging shell, and a closed space is defined by the infrared optical filter and the DFN packaging shell; the DFN packaging shell is provided with an air guide hole and an exhaust hole, the bottom of the DFN packaging shell is provided with a pin, and the inner wall of the DFN packaging shell is provided with a metal shielding layer and a SiO2 film. The DFN packaged digital infrared temperature sensor has the advantages of miniaturization, low cost, high electromagnetic shielding efficiency, highmeasurement precision, high readability, simple forming process, suitability for large-scale production and wide application.

Description

technical field [0001] The invention belongs to the technical field of infrared temperature sensors, and in particular relates to a digital infrared temperature sensor packaged with DFN. Background technique [0002] After the sensitive unit of the infrared temperature sensor absorbs the infrared radiation of the target to be measured, the infrared light absorption area will generate a temperature rise, which will cause changes in some physical quantities of the temperature sensor, such as changes in thermal voltage or thermal resistance. One advantage of the infrared temperature sensor is that it can realize non-contact measurement. In the occasions where it is not suitable to be in contact with the target to be measured, contact temperature measurement can be avoided. For example, in the epidemic prevention of infectious diseases, non-contact temperature measurement plays an important role. In addition, the infrared temperature sensor also has the advantages of fast respon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/12G01J5/16G01J5/04C23C14/24C23C14/10C23C14/20C23C14/16
CPCG01J5/12G01J5/16G01J5/04G01J5/048G01J5/046C23C14/24C23C14/10C23C14/20C23C14/16
Inventor 杨明鹏鹿永琪冯李航姚敏
Owner NANJING UNIV OF INFORMATION SCI & TECH
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