Mask, method for preparing semiconductor device and semiconductor device

Abstract

The invention provides a mask, a method for preparing a semiconductor device and the semiconductor device. The mask comprises a mask substrate, and the mask substrate is provided with at least one effective windowing area and a non-windowing area surrounding the at least one effective windowing area; at least one invalid windowing area is arranged on the outer side of at least one effective windowing area, and the invalid windowing area can enable a developing area formed by the corresponding effective windowing area not to deform when heated. The invention discloses the mask, the invalid windowing area is designed in an open area, exposing and developing are conducted through the invalid windowing area to obtain a developing non-windowing area on a photoresist, the thermal expansion effect of the baking process is transferred to the developing non-windowing area, a developing windowing area on the photoresist obtained through the normal windowing area on the mask is protected againstthe influence of the photoresist expansion effect, due to the fact that the invalid windowing area is small in width, the exposed photoresist layer cannot be displayed during developing, Bump cannot be produced subsequently, and the product cannot be affected.

Description

technical field [0001] The disclosure belongs to the technical field of semiconductors, and in particular relates to a mask, a method for preparing a semiconductor device and a semiconductor device. Background technique [0002] In the existing manufacturing process of semiconductor devices, such as post-process gold bump packaging, the industry generally uses negative photoresists. Due to the easy expansion of negative photoresists, windows are opened after development and baking in the yellow light process. The area will expand to the open non-window area, resulting in deformation of the window, especially the first window on the edge of the chip, which will lead to the appearance deformation and poor verticality of the bump after the long gold bump (Bump) during packaging, affecting Bump reliability. [0003] Such as figure 1 As shown, it is a schematic diagram of a traditional mask structure. The mask 100 includes a light-shielding area 101 and a light-transmitting are...

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Problems solved by technology

[0005]At present, the industry mainly solves the above problems by improving the baking process, such as reducing the baking temperature and time, reducing part of the baking process, etc., but this This method cannot completely solve the deformation problem, and at the same time, it may also cause insufficient baking of the photoresist, which will lead to long-term bump and post-plating, which will affect the process yield.

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