Ultrathin composite transparent conductive film and preparation method thereof
A transparent conductive film, ultra-thin technology, applied in the direction of equipment used to manufacture conductive/semiconductive layers, cable/conductor manufacturing, conductive layers on insulating carriers, etc., can solve the complex production process, deformation of capacitor electrode pattern size, Problems such as high cost can be achieved to improve the insulation effect, prevent short circuit problems, and improve the yield rate
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[0081] This embodiment also provides a preparation method for the above-mentioned ultra-thin composite transparent conductive film, including the following main steps:
[0082] 1. First, apply UV curable glue on the surface of the transparent substrate.
[0083] Before coating the surface of the transparent substrate with UV curable adhesive, it is preferable to age the transparent substrate. Of course, according to different materials, the transparent substrate may not be aged, but some materials will have deviations in the size of the upper and lower lines if they are not aged. Among them, the aging method can be to place the transparent substrate under a plasma blower at a temperature of 50-150°C for 5-60 seconds to remove impurities on the surface of the substrate and stabilize the properties of the substrate; the material of the transparent substrate can be PET, PC, PMMA etc., the thickness of the transparent substrate is 50-200 microns. The above-mentioned UV curing gl...
Embodiment 2
[0106] Such as Figure 4 As shown, this embodiment discloses an ultra-thin composite transparent conductive film, including a transparent substrate 1, a first conductive layer 3 disposed on the transparent substrate, and a second conductive layer 6 disposed on the first conductive layer 3, A transparent reinforced insulation support layer 4 is arranged between the first conductive layer 3 and the second conductive layer 6, and the second conductive layer 6 is arranged on the cured reinforced insulation support layer 4;
[0107] Different from the first embodiment, the first conductive layer of the second embodiment is formed by conductive material filled in grid grooves opened on the transparent substrate 1 .
[0108] It should be noted that, compared with Embodiment 1, the first UV adhesive layer is removed in Embodiment 2, which is equivalent to thinner thickness of the ultra-thin composite transparent conductive film. However, the method of embossing grid grooves directly o...
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