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Method for formation of patterned solder mask layer, method for manufacturing printed circuit board and/or electrical component, and article

A technology for printed circuit boards and electrical components, applied in the field of chemical vapor deposition to form a patterned protective layer

Pending Publication Date: 2020-09-15
PICOSUN OY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] It is an object of the present invention to solve or at least alleviate each of the problems arising from limitations and disadvantages of the related art

Method used

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  • Method for formation of patterned solder mask layer, method for manufacturing printed circuit board and/or electrical component, and article
  • Method for formation of patterned solder mask layer, method for manufacturing printed circuit board and/or electrical component, and article
  • Method for formation of patterned solder mask layer, method for manufacturing printed circuit board and/or electrical component, and article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Embodiment 1, base 11 is made of trimethylaluminum (TMA, Al(CH 3 ) 3 ) and formed on water as an alumina layer (Al 2 o 3 ) mask 10 provided. Deposition temperatures range from about 20°C (room temperature) to about 300°C.

Embodiment 2

[0059] Embodiment 2, on substrate 11 by titanium tetrachloride (TiCl ) and water deposition as titanium dioxide layer (TiO 2 ) mask 10 provided. Deposition temperatures range from about 20°C (room temperature) to about 300°C.

Embodiment 3

[0060] Embodiment 3, on substrate 11 by niobium ethoxide (Nb 2 (OC 2 h 5 ) 10 ) and water deposited as niobium dioxide layer (Ni 2 o 5 ) mask 10 provided. Deposition is possible at least in the range of 90°C to 150°C.

[0061] In all examples, the layers produced in a single ALD cycle (pulsed first precursor-purge; pulsed second precursor-purge) were approximately 0.1 nm. In order to deposit a layer with a thickness of 10-100 nm, the above reaction (cycle) is repeated a predetermined number of times. Depending on the number of cycles desired and the duration of each cycle, the deposition process can be accomplished within a time range of about 10 minutes to about 20 hours.

[0062] For the purposes of the present invention, the mask 10 is preferably deposited as a layer having a thickness in the range 10-500 nm, preferably in the range 20-200 nm, more preferably in the range 50-200 nm, eg 100 nm.

[0063] In a similar manner, mask 10 may be built from three or more pre...

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PUM

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Abstract

The invention relates to a method for formation of a patterned solder mask layer, a method for manufacturing a printed circuit board and / or an electrical component, and an article. A method for formation of a patterned solder mask (10) on a substrate is provided, in which method the mask is deposited by a process of chemical deposition in vapor phase. A method for manufacturing a printed circuit board and / or an electronic component comprising formation of the patterned solder mask is further provided.

Description

technical field [0001] The present invention generally relates to printed circuit boards and electrical components and methods of making the same. In particular, the present invention relates to methods of forming patterned protective layers by chemical vapor deposition. Background technique [0002] Forming a solder mask or solder resist protective layer on a printed circuit board (PCB) is generally known in the art. A typical PCB consists of an epoxy base layered with a conductive material and further deposited with a layer that prevents solder (such as tin solder) from wetting and its contact with the underlying metal (such as copper or silver) during reflow. [0003] The solder mask protects the conductive material from oxidation with (air) and / or corrosion caused by the presence of sulfur-containing pollutants in the ambient air. Due to the presence of sulfur compounds in ambient air such as hydrogen sulfide (H 2 S)), creep corrosion (Creepcorrosion) has become a ser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/10H05K1/09
CPCH05K3/10H05K3/0079H05K1/09H05K3/3452H05K2203/0597H05K2203/1338H05K3/3457H01L21/0272B23K2103/50B23K2101/42B23K1/015
Inventor 马尔科·普达斯
Owner PICOSUN OY