Immersed heat dissipation device for data center

A technology for data centers and cooling devices, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc. Low starting temperature, flexible installation form, low vibration and noise

Pending Publication Date: 2020-09-15
ENERGY RES INST OF SHANDONG ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the oil pump is noisy during operation and increases energy consumption. Its vibration is also a hidden danger to the safe and stable operation of the system. The choice of radiator and refrigerant also increases the cost.
[0007] Both direct cooling and immersion cooling systems have the disadvantages of high cost, high vibration or noise, and the layout is limited by the space of the machine room.

Method used

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  • Immersed heat dissipation device for data center
  • Immersed heat dissipation device for data center
  • Immersed heat dissipation device for data center

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Three liquid-cooled cabinets are arranged in one computer room 1, and several servers 5 are arranged in the liquid-cooled cabinets, and the several servers 5 are arranged in layers. The three liquid-cooled cabinets are respectively the first liquid-cooled cabinet 2, the second liquid-cooled cabinet 3, and the third liquid-cooled cabinet 4, and the oscillating heat pipes provided in the first liquid-cooled cabinet 2 are arranged in an L shape. The evaporation area 9 is located in the liquid-cooled cabinet, the condensation area 7 is located outside the machine room, and the heat insulation area 8 is located in the connection area with the machine room and the liquid-cooled cabinet. The side view of the oscillating heat pipe 6 of the first liquid-cooled cabinet 1 is shown in image 3 As shown, the oscillating heat pipe is arranged in an L shape. The evaporation area 9 of the oscillating heat pipe 6 absorbs the heat of the liquid-cooled cabinet, and then dissipates the hea...

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PUM

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Abstract

The invention relates to an immersed heat dissipation device for a data center. The device comprises a liquid cooling cabinet, cooling liquid and a plurality of oscillating heat pipes, the liquid cooling cabinet is filled with the cooling liquid, evaporation areas of the oscillating heat pipes extend into the liquid cooling cabinet, the condensation areas of the oscillating heat pipes are locatedon the outer side of the liquid cooling cabinet, pipe bundles of the oscillating heat pipes are filled with media, the media are organic solvents, the connecting areas of the oscillating heat pipes and the side wall of the liquid cooling cabinet are heat insulation areas, and the heat insulation areas are located between the condensation areas and the evaporation areas. The heat in the cooling liquid is transferred to the outer side of the liquid cooling cabinet by utilizing the oscillating heat pipes. A heating element transmits heat to the cooling liquid; the evaporation areas of the heat pipe bundles are immersed in cooling liquid to absorb heat of the cooling liquid, the heat pipe bundles are filled with organic solvents with certain pressure to serve as the media, the media are evaporated after being heated, gas-liquid phase plunger type fluid is formed in the heat pipe bundles, and the plunger type fluid rapidly transmits the heat to the condensation areas of the heat pipe bundles. The heat transfer coefficient is high, the energy consumption is low, the energy is saved, and the environment is protected.

Description

technical field [0001] The invention belongs to the technical field of liquid cooling, and in particular relates to an immersion heat dissipation device for a data center. Background technique [0002] The information disclosed in this background section is only intended to increase the understanding of the general background of the present invention, and is not necessarily taken as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. [0003] With the continuous development of the Internet and computer technology, the construction of data centers under the background of the big data era is also developing rapidly. The rapid development of big data has brought both opportunities and new challenges to the development of computers. Due to the increasing demand for global data processing, high energy consumption indicators have also brought new challenges to the rapid development of data centers. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20236H05K7/20781H05K7/20827
Inventor 耿文广李子淳员冬玲孙荣峰王鲁元姜建国
Owner ENERGY RES INST OF SHANDONG ACAD OF SCI
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