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A Frequency Selective Structure Using Temperature Sensitive Resistors to Realize Reconfigurable Passband

A temperature sensitive resistor and frequency selection technology, applied in circuits, electrical components, waveguide devices, etc., can solve the problems of increased frequency selection surface design workload, increased frequency selection surface design and processing costs, etc.

Active Publication Date: 2021-10-22
NINGBO UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This not only leads to an increase in the design workload of the frequency selective surface, but also increases the design and processing costs of the frequency selective surface

Method used

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  • A Frequency Selective Structure Using Temperature Sensitive Resistors to Realize Reconfigurable Passband
  • A Frequency Selective Structure Using Temperature Sensitive Resistors to Realize Reconfigurable Passband

Examples

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Embodiment

[0010] Example: such as figure 1 As shown, a frequency selective structure using temperature sensitive resistors to realize reconfigurable passband, including a dielectric substrate 1, the cross section of the dielectric substrate 1 is a square, a square copper foil block is attached to the upper surface of the dielectric substrate 1, and the square copper foil The side length of the block is equal to the side length of the dielectric substrate 1, the front end face of the square copper foil block is located in the same plane as the front end face of the dielectric substrate 1, the rear end face of the square copper foil block is located in the same plane as the rear end face of the dielectric substrate 1, and the square copper foil block is located in the same plane as the rear end face of the dielectric substrate 1. The left end surface of the foil block and the left end surface of the dielectric substrate 1 are located on the same plane, the right end surface of the square c...

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Abstract

The invention discloses a reconfigurable frequency selection structure using a temperature-sensitive resistor, which includes a dielectric substrate, the cross section of which is a square, and a square copper foil block attached to the upper surface of the dielectric substrate. A regular hexagonal annular groove is provided, and the regular hexagonal annular groove divides the square copper foil block into a first copper foil area located outside it and a second copper foil area located inside it, the first temperature-sensitive resistor, the second The temperature sensitive resistor, the third temperature sensitive resistor and the fourth temperature sensitive resistor are evenly arranged between the first copper foil area and the second copper foil area, and the working temperature range of these four temperature sensitive resistors is minus 5 degrees Celsius to Positive 300 degrees Celsius; the advantage is that it can realize bandpass characteristics in multiple frequency bands, and when applied to frequency selective surfaces, it can reduce the design workload of frequency selective surfaces and reduce the design and processing costs of frequency selective surfaces.

Description

technical field [0001] The invention relates to a frequency selection structure, in particular to a frequency selection structure using a temperature-sensitive resistor to realize reconfigurable passband. Background technique [0002] For a long time, with the continuous innovation and development of various communication technologies, the spectrum resources are fixed, which leads to more and more tight spectrum resources. Therefore, improving the utilization of spectrum resources has always been the top priority of many researchers. Among them, the bandpass structure has attracted the attention of researchers, and some research results have been obtained. Common bandpass structures are mainly realized based on microstrip line structure, integrated waveguide structure or cavity structure. The bandpass structure based on the microstrip line structure forms the bandpass characteristic by laying a microstrip line with a certain structural shape above the dielectric substrate; ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20
CPCH01P1/2002
Inventor 华昌洲陈国军黄雪琴陈益丁世宇
Owner NINGBO UNIV
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