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Special device for laser cutting of diamond material

A laser cutting and special device technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of diamond weight loss, economic value loss, large size, etc., to improve cutting quality and efficiency, and ensure processing quality Effect

Pending Publication Date: 2020-10-02
广州三义激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are two main factors that affect the quality of laser diamond cutting: one is the loss of diamond weight, because the volume is large and the value is high, and a small loss of weight is a considerable loss of economic value; Subsequent processing and service life of diamonds
The actual test application shows that different cutting directions of diamonds will lead to inconsistent cutting quality and efficiency during the special-shaped cutting process

Method used

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  • Special device for laser cutting of diamond material
  • Special device for laser cutting of diamond material
  • Special device for laser cutting of diamond material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] refer to Figure 1-2 , the rotating motor 10 is a hollow shaft motor, the wave plate 9 is connected to the rotating shaft of the rotating motor 10, the structure arranged coaxially between the rotating motor 10 and the wave plate 9, the rotating motor 10 is installed on the frame 7, and the laser 11 passes through the external optical path in turn The module 2 and the wave plate 9 irradiate the workpiece 4 .

Embodiment 2

[0040] refer to image 3 , the rotating motor 10 is a hollow-shaft motor, the wave plate 9 is connected to the rotating shaft of the rotating motor 10, the structure arranged coaxially between the rotating motor 10 and the wave plate 9, the wave plate 9 is installed on the laser output end of the laser 1, and the laser 11 is in turn The workpiece 4 is irradiated through the wave plate 9 and the external optical path module 2 .

Embodiment 3

[0042] refer to Figure 4 , the rotating motor 10 is a hollow-shaft motor, the wave plate 9 is connected to the rotating shaft of the rotating motor 10, the structure arranged coaxially between the rotating motor 10 and the wave plate 9, and the wave plate 9 is installed on the incident end or the outgoing end of the external optical path module 2 , the laser 11 irradiates the workpiece 4 through the wave plate 9 and the external optical path module 2 in sequence, or irradiates the workpiece 4 through the external optical path module 2 and the wave plate 9 in sequence.

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Abstract

The invention discloses a special device for laser cutting of a diamond material, relates to diamond cutting, and mainly solves the technical problem of poor quality of existing laser diamond cutting.The device comprises a laser, an external optical path module, a motion control system, an XYZ motor module, a coaxial imaging processing head module and a polarization adjustment module, wherein thecoaxial imaging processing head module comprises a rack; a visual detection mechanism is arranged on the rack; the polarization adjustment module comprises a wave plate and a rotary motor; the motioncontrol system is connected to the laser, the XYZ motor module, the visual detection mechanism and the rotary motor; the laser emitted by the laser is irradiated to a workpiece through the external optical path module and the wave plate; the motion control system controls the rotary motor to adjust the rotation angle of the wave plate or the workpiece in real time according to the cutting trajectory of the workpiece, so that the polarization state direction of the laser is tangent to the cutting trajectory, and the cutting quality and efficiency can be improved.

Description

technical field [0001] The present invention relates to diamond cutting, and more particularly, it relates to a special device for laser cutting diamond material. Background technique [0002] With the continuous development of laser technology, laser processing is widely used in industry. Laser cutting materials is the most common application in laser processing. Laser cutting is a non-contact cutting method. Compared with traditional cutting methods, laser cutting has the advantages of good cutting quality, high production efficiency, wide application range, and low production cost. low merit. Laser cutting actually uses a focusing mirror to focus a high-energy laser onto the surface of a material to generate a high temperature enough to melt or even vaporize the material, and then separates the material with auxiliary gas jet blowing to achieve the purpose of cutting. In the practice of laser cutting, many factors affect the cutting quality and efficiency. In addition t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/402B23K26/70
CPCB23K26/362B23K26/402B23K26/70B23K26/702
Inventor 陈聪李国栋廖世明
Owner 广州三义激光科技有限公司
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