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Process for manufacturing a silicon carbide coated body

A silicon carbide, process technology, used in susceptors and reactors, manufacturing products for high temperature applications, semiconductor materials and wafers, can solve problems affecting SiC and by-product formation

Active Publication Date: 2020-10-16
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it can be seen that, under the applied CVD conditions, only amorphous SiC is deposited, as in ( Figure 7a ), and as shown in the XRD pattern ( image 3 ) it can be seen that varying the temperature significantly affects the formation of SiC and by-products

Method used

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  • Process for manufacturing a silicon carbide coated body
  • Process for manufacturing a silicon carbide coated body
  • Process for manufacturing a silicon carbide coated body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0571] Example 1 - Activation and Chlorination of Graphite Building Blocks, and Tendril Formation

[0572] The porous graphite member is activated, purified and subjected to the chlorination treatment described in the present invention.

[0573] The following chlorine contents were measured in the chlorinated graphite components:

[0574] element Graphite components Cl 0.06ppm wt.

[0575] and Figure 8a to Figure 8c compared to, Figure 7a to Figure 7c The formation of activated graphite with increased surface porosity is shown in . SEM has been prepared as described above.

[0576] In the CVD deposition method described here, a chlorinated graphite member is used as the porous graphite substrate (1).

[0577] In the CVD method, SiC tendrils (4) according to the invention are formed in the pores (6) of the correspondingly chlorinated graphite substrate, as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5a , Figure 5b , Figure 6a a...

Embodiment 2

[0579] Example 2 - Effect of purge gas

[0580] Use H 2 A silicon carbide-coated body was produced by the process of the invention as a purge gas.

[0581] As a comparative example, argon was used as the purge gas.

[0582] as from figure 1 and Figure 4 It became apparent that the use of argon did not cause tendrils to form (4).

Embodiment 3

[0583] Example 3 - Multilayer SiC Coating

[0584] Silicon carbide coated bodies were prepared using the process of the present invention, wherein the amount of DMS was varied to produce multilayer SiC coatings with varying densities (2-A), (2-B), (2-C), etc.

[0585] where, in the deposition stage using H 2 The following amounts of DMS were introduced as carrier gas into the process chamber of the bench-scale test reactor:

[0586] deposition stage Amount of DMS 1. about 0.5g / min 2. About 1.0g / min 3. About 1.5g / min 4. About 2.0g / min

[0587] The SiC coatings deposited in the first to fourth deposition stages exhibited varying crystal sizes that increased with increasing amounts of DMS, resulting in SiC coatings with progressively decreasing densities.

[0588] figure 2 Another example showing SiC multilayer structures due to varying amounts of DMS is shown in .

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Abstract

The present invention relates to a new process for manufacturing a silicon carbide (SiC) coated body by depositing SiC in a chemical vapor deposition method using dimethyldichlorosilane (DMS) as the silane source on a graphite substrate. A further aspect of the present invention relates to the new silicon carbide coated body, which can be obtained by the new process of the present invention, and to the use thereof for manufacturing articles for high temperature applications, susceptors and reactors, semiconductor materials, and wafers.

Description

technical field [0001] The present invention relates to a new process for manufacturing SiC-coated bodies by depositing silicon carbide (SiC) on graphite substrates in a chemical vapor deposition method using dimethyldichlorosilane (DMS) as a silane source. Another aspect of the invention relates to new silicon carbide coated bodies obtainable by the new process of the invention and to the use of said silicon carbide coated bodies for the manufacture of high temperature applications, susceptors and reactors, semiconductor The use of materials and products of wafers. Background technique [0002] SiC coated bodies are important products in various technical fields and are particularly useful for high temperature applications such as susceptors and wafers for applied materials and reactors, semiconductor materials, chip manufacturing, etc. [0003] In particular, in high-temperature applications and when applied in high-precision devices, providing SiC-coated bodies (coated ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/50C04B41/49C04B41/87C04B41/00C23C16/32C04B111/00
CPCC23C16/325C23C16/52C04B41/87C04B41/009C04B41/5059C23C16/0218C23C16/045C23C16/45523C04B2111/00405C04B35/522C04B38/00C04B41/4531C04B41/526C04B2235/3826
Inventor 彼得·J·盖尔西奥保罗·维斯特法尔
Owner APPLIED MATERIALS INC