COB packaging process for MicroLED display screen

A packaging process and display technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of increased cost of a single LED device, increased geometric order, increased process difficulty, etc., to achieve fast installation and production methods, The effect of reducing equipment cost and reducing chip thermal resistance

Inactive Publication Date: 2020-10-27
SHANDONG VOURY OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As people's requirements for the resolution of indoor and outdoor LED displays are getting higher and higher, if the traditional SMD LED devices are still used for patch assembly of LED displays, then on the one hand, because the LED display devices are getting smaller and smaller, the process difficulty is sharply increasing. increase, the yield r

Method used

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Examples

Experimental program
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Example Embodiment

[0030] Example:

[0031] An embodiment of the present invention provides a COB packaging process for a MicroLED display screen. The packaging process includes the following steps:

[0032] S1. Cleaning: Prepare the PCB printed circuit board, check whether the PCB printed circuit board is qualified, and then use a wiping white cloth to dip the board washing water, and wipe the PCB printed circuit board from the middle to both sides;

[0033] S2. Crystal expansion: The entire LED wafer film is evenly expanded by an expansion machine, so that the closely arranged LED chips attached to the surface of the film are pulled apart;

[0034] S3. Adhesive: put the expanded crystal ring on the surface of the adhesive machine that has scraped the silver paste layer, and use a dispenser to dispense an appropriate amount of silver paste on the PCB printed circuit board;

[0035] S4, thorn crystal: put the crystal expansion ring prepared with silver paste into the thorn crystal frame, the st...

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PUM

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Abstract

The invention provides a COB packaging process for a MicroLED display screen, and relates to the technical field of COB packaging. The COB packaging process for the MicroLED display screen comprises the following steps: S1, cleaning: preparing a PCB, then dipping board washing water on wiping white cloth, and wiping the PCB from the middle to two sides; S2, wafer expanding: uniformly expanding thewhole LED wafer thin film by adopting an expanding machine, so that the LED crystal grains which are tightly arranged and attached to the surface of the thin film are pulled open; and S3, back gluing: dispensing a proper amount of silver paste on the PCB by adopting a dispensing machine. According to the invention, the COB integrated package can reduce the cost and simplify the manufacturing process of the LED screen; the thermal resistance of the chip can be reduced; high-density packaging is achieved, the heat dissipation area of a device is expanded to a certain extent by selecting the COBpackaged LED display screen, so that generated heat is diffused to the outside more easily, the cost is reduced, and compared with a traditional packaging mode, the packaging cost of the device can be saved in actual application of the LED display module.

Description

technical field [0001] The invention relates to the technical field of COB packaging, in particular to a COB packaging process for Micro LED display screens. Background technique [0002] Micro LED Display (Micro LED Display) is a new generation of display technology. Its LED structure is thinned, miniaturized and arrayed, making its volume about 1% of the size of mainstream LEDs. Each pixel can be addressed, Drive the light independently, reduce the pixel pitch from millimeter level to micron level, so that the theory can reach more than 1500ppi or even 2000ppi ultra-high resolution, Micro LED inherits LED low power consumption, high brightness, ultra-high resolution, color saturation, responsiveness It has the advantages of fast speed, super power saving, long life and high efficiency. [0003] As people's requirements for the resolution of indoor and outdoor LED displays are getting higher and higher, if the traditional SMD LED devices are still used for patch assembly o...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/54
CPCH01L25/0753H01L33/54H01L2933/005
Inventor 孙明存韩福涛孙鲁闽
Owner SHANDONG VOURY OPTOELECTRONICS TECH CO LTD
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