A three-dimensional measurement device and measurement method for cross-scale micro-nano structures

Abstract

The invention discloses a cross-scale micro-nano structure three-dimensional measurement device and measurement method, which is characterized in that it includes an atomic force probe scanning microscope assembly, an objective lens turntable, a white light interference system, a nanoscale vertical micro-displacement platform, and a laser interference displacement measurement system. , measurement and control system, laser interferometric displacement measurement system 2, sample, two-dimensional piezoelectric ceramic scanning platform, two-dimensional electric scanning platform and laser interferometric displacement measurement system three; by rotating the objective mirror turntable, the measuring device is in the white light interferometry mode and atomic force Switches between probe scanning measurement modes. The white light interferometry mode is mainly used for large-scale measurement of micron-scale structures. The atomic force probe scanning measurement mode performs horizontal high-resolution measurement of nanoscale characteristic areas, and realizes large-scale and high-resolution measurement of cross-scale micro-nano structure surfaces. The measurement of cross-scale (microscale, submicron and submicron scale) structures is realized in one system.

Description

technical field [0001] The invention belongs to the field of ultra-precise surface topography measurement, and in particular relates to a three-dimensional measurement device and method for cross-scale micro-nano structures. Background technique [0002] With the development of advanced manufacturing technologies such as lithography, ultra-precision processing, and optical processing, the surface of cross-scale micro-nano structures has become an important surface feature of key components in the fields of solar cells, laser holographic anti-counterfeiting, and flat-panel displays. The overall macroscopic size of these features is gradually increasing, while the local microscopic features are more refined, resulting in the measurement requirements of both large-scale and high-resolution. Traditional surface topography measurement instruments, such as stylus profilers, optical profilers, atomic force microscopes, etc., have been widely used in ultra-precision surface measurem...

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Problems solved by technology

[0004] Aiming at at least one of the above defects or improvement needs in the prior art, the present invention provides a three-dimensional measurement device for cross-scale micro-nano structures, which can realize large-scale and high-resolution measurement of the surface of cross-scale micro-nano structures, and can The measurement of cross-scale (micron-scale, sub-micron and below-scale) structures can be realized in this set of systems, which avoids the problem of positioning reference errors caused by the need for different measuring instruments to measure micron-scale structures and sub-micron and below-scale structures, and high-resolution It is difficult to find the measured area when force instruments measure submicron and below-scale structures, and the data fusion and time-consuming problems brought about by the collaborative measurement of multiple instruments

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