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Block copolymer compositions, prepregs, and laminates made thereform

A technology of block copolymers and polymers, applied in lamination, lamination devices, coatings, etc., can solve the problems of rigid polystyrene block finite temperature performance limitations and other issues

Pending Publication Date: 2020-11-03
KRATON POLYMERS RES BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The described styrenic block copolymers are limited by the limited temperature properties of their rigid polystyrene blocks

Method used

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  • Block copolymer compositions, prepregs, and laminates made thereform
  • Block copolymer compositions, prepregs, and laminates made thereform

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6

[0088] Embodiments 1-6: See Table 3 for the amounts of the above materials. The properties of the compositions after drying and curing (180°C, 1 hour) are also shown.

[0089] table 3

[0090] unit Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Block Copolymer 1 share 100 90 - - - - Block Copolymer 2 share - - 100 70 100 - DCP share 6 6 1 3 - 3 B3000 share - 10 - 30 - 100 TAIC share - - - 0.45 - - share - - - - - - Curing temperature / time ℃ / min 180 / 60 180 / 60 180 / 60 180 / 60 180 / 60 180 / 60 Cured Tg ℃ 137 136 124 157 135 <100

Embodiment 5

[0091] Example 5 shows that block copolymers cannot be effectively cured at 180°C with a 60 minute cure cycle without a cure initiator. Efficient curing results in a significant gel content and the swelling ratio of the gel is not too high. Example 5 did not cure properly (gel content about 0%). Example 6 did not have sufficient Tg before and after curing.

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Abstract

A resin composition that allows production of laminated sheets excellent in heat resistance and processability is disclosed. The resin composition comprises: a) a block copolymer, where the block copolymer comprises at least one polymer block comprising polymerized acyclic conjugated diene units, such as butadiene units, and at least one polymer block containing units like a conjugated cyclic diene such as 1,3-cyclohexadiene or monomer units characterized by unit Tg above 100 DEG C., b) a curing initiator, and c) optionally diene-based polymer selected from a polybutadiene polymer and the copolymer of butadiene with styrene or other styrenic monomers, c) optional additives comprising but not limited to a multi-functional co-curable additive, a diene based rubber, a halogenated or non halogenated flame retardant, an inorganic or organic filler or fiber, an antioxidant, a adhesion promotor, a film forming.

Description

technical field [0001] The present disclosure relates to low dissipation, low dielectric curable block copolymer compositions and products made therefrom, including copper clad laminates and printed circuit boards. Background technique [0002] With the rapid development of electronic technology, large-capacity computer systems and networks require high-frequency signal transmission, and circuit substrates are suitable for high-frequency and high-speed transmission. It is desirable for circuit substrates to operate signals at high frequencies and low transmission losses such as dielectric loss, conductor loss, and radiation loss. Transmission loss weakens electrical signals and destroys signal reliability. [0003] Traditionally, printed circuit boards use epoxy resins, which have high dielectric constant and dielectric loss tangent values. Epoxy resins can be combined with phenolic compounds, amines or anhydride curing agents to enhance performance. It is still difficult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L53/00C08L9/00C08K5/14C08K5/3492C08J5/24B32B15/04B32B15/20B32B33/00H05K1/03
CPCC08L53/00C08K5/14C08J5/24B32B15/04B32B15/20B32B33/00H05K1/0366B32B2255/02B32B2255/26B32B2457/08C08J2353/00C08J2409/00C08L2203/20C08L9/00C08K5/34924H05K1/0373C08F287/00C08F297/02B32B2307/206B32B5/26B32B5/022B32B5/024B32B5/12B32B2262/101B32B2260/023B32B2260/046B32B15/14B32B2264/10B32B2264/02H05K2201/0209H05K2201/0212H05K2201/012C08F226/06C08L101/00C08F297/044C08F297/048B29B15/125B32B15/08B32B2305/076C08L47/00B32B5/02B32B37/06B32B37/10B32B37/182B32B2260/021B32B2307/202B32B2311/12B32B2323/00C08L2205/025C08L2205/03C09D153/00
Inventor 丁瑞栋牛亚明B·杨X·穆德曼斯F·德维特杨慧娴
Owner KRATON POLYMERS RES BV